Gigavis, a global leader in semiconductor substrate inspection, announced on March 3 that it has signed an equipment supply contract worth approximately 10 billion won with a Chinese-speaking region-based semiconductor substrate (PCB) manufacturer.
This contract involves the supply of high-resolution inspection and repair equipment for FC-BGA substrates used in artificial intelligence (AI) servers. By utilizing an integrated solution that combines Gigavis's unrivaled hardware manufacturing capabilities and proprietary software technology, the company is expected to help the client enhance process efficiency and achieve tangible yield improvements.
In addition to this new order, Gigavis explained that it is currently discussing multiple projects with major FC-BGA customers related to AI, indicating a high possibility of additional orders in the future. In particular, with the growing demand for AI servers, major FC-BGA customers are maintaining high utilization rates, and as global substrate manufacturers' expansion plans become more visible, related equipment investment demand is expected to continue increasing.
A Gigavis representative stated, "The acceleration of the AI server and high-performance computing (HPC) industries is rapidly driving the growth of the high-end FC-BGA substrate market," adding, "We will further strengthen our market dominance in the AI semiconductor packaging process by leveraging our unparalleled inspection and repair solutions."
© The Asia Business Daily(www.asiae.co.kr). All rights reserved.
