[MWC26] SKT to Build AI Data Centers Faster and Cheaper with Three-Party Global Partnership

MOU Signed with Supermicro and Schneider Electric

Securing an Integrated Solution Using the 'Prefab Modular' Method

Prefabricated AIDC Modules Assembled On-Site

SK Telecom is collaborating with global partners to reduce the time and costs involved in building artificial intelligence (AI) data centers (DC). The company plans to join forces with leading global companies in server and equipment manufacturing to establish a new type of data center solution.

SK Telecom announced on March 4 that it has signed a tripartite Memorandum of Understanding (MOU) with server manufacturer Supermicro and AI DC MEP (mechanical, electrical, plumbing) manufacturer Schneider Electric at the Mobile World Congress (MWC) 2026, the world's largest mobile exhibition held in Barcelona, Spain, to secure an integrated solution using the 'prefab modular' method.

SK Telecom announced on the 4th that it has signed a tripartite Memorandum of Understanding (MOU) for securing an integrated solution using the 'prefab modular' method with server manufacturer Supermicro and AI data center MEP (mechanical, electrical, plumbing) manufacturer Schneider Electric at the Mobile World Congress (MWC) 2026, the world's largest mobile exhibition held in Barcelona, Spain. Haminyong, Head of AI Data Center Business at SK Telecom, Andrew Bradner, Senior Vice President of Schneider Electric, and Clay Simons, Vice President of Supermicro, are posing for a commemorative photo after signing the agreement. (from left) Provided by SK Telecom

This collaboration focuses on securing an integrated model that shortens the construction period of AI DCs and resolves supply bottlenecks. The core of this partnership is the prefab modular method, which involves pre-manufacturing power, cooling, and IT infrastructure as modules and assembling them on-site. This approach can dramatically reduce the time required to build AI DCs.

Unlike the traditional steel reinforced concrete (SRC) method, where servers are sequentially installed after building completion, the new approach integrates servers, power, and cooling infrastructure into a single module for unified production. This simultaneously improves both construction speed and cost efficiency. In addition, modules can be incrementally added as demand increases, enabling flexible responses to market needs while easing the burden of initial large-scale investments.

Supermicro, a manufacturer of server and storage systems, designs and supplies high-performance graphics processing unit (GPU) servers specialized for AI training and inference through partnerships with major AI semiconductor companies. Last year, the company collaborated with leading US big tech firms to build large-scale AI factories using NVIDIA Blackwell GPU-based servers and liquid cooling technology.

Supermicro plans to build high-performance servers that perform AI computations, as well as GPU clusters that connect them. The company is also preparing an integrated configuration that takes into account key infrastructure elements such as cooling, supporting the rapid construction of AI DCs.

Schneider Electric, a company specializing in energy management and automation, provides DC power management and digital operations management solutions. Last year, it was ranked No. 1 in the world for two consecutive years on TIME magazine's list of the "World's Most Sustainable Companies."

In this collaboration, Schneider Electric plans to provide an MEP-based AI DC integrated model that takes into account both infrastructure design and operational efficiency from the outset.

Haminyong, Head of AI Data Center Business at SK Telecom, said, "Through collaboration with global partners representing the AI DC field, we are pushing forward with an integrated solution using the prefab modular method. Based on this, we will proactively respond to the AI DC construction needs of global big tech clients and further enhance our competitiveness in terms of costs."

Clay Simons, Vice President of Supermicro, said, "This integrated solution will be based on Supermicro's high-performance GPU-optimized servers, which are tailored to customer workloads. We will continue to offer the latest technologies to meet the rapidly growing demand for AI DCs."

Andrew Bradner, Senior Vice President of Schneider Electric, stated, "Competitiveness in the AI era depends on how quickly and sustainably high-performance infrastructure can be built. Through this collaboration, we will present a prefab modular-based AI DC integrated model to reduce carbon emissions and resolve supply bottlenecks, while reliably supporting customers' high-density AI workload operations."

This content was produced with the assistance of AI translation services.