Chey Taewon Holds Back-to-Back Meetings with Five US Big Tech Chiefs... Quick Steps to Expand the AI Ecosystem

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Chey Taewon, Chairman of SK Group, who is currently visiting the United States, has held a series of meetings with the heads of leading global big tech companies such as Nvidia, Google, Microsoft (MS), Broadcom, and Meta Platforms. By sharing SK hynix's high bandwidth memory (HBM) roadmap and technology development direction, his strategy is to establish the company as a core pillar of next-generation AI infrastructure.

According to the SK hynix Newsroom on February 13, Chairman Chey began with a "chicken and beer meeting" with Nvidia CEO Jensen Huang on the 5th (local time), and over the following six days met in succession with Broadcom CEO Hock Tan, MS CEO Satya Nadella, Meta CEO Mark Zuckerberg, and Google CEO Sundar Pichai.

Chey Taewon (left), chairman of SK Group, met Huang Jensen, CEO of NVIDIA (right). SK Hynix Newsroom

Invited to "99 Chicken," a Korean-style pub located in Santa Clara in Silicon Valley, Chairman Chey was confirmed to have exchanged a wide range of views with CEO Huang on the AI industry. During the meeting, Chairman Chey introduced SK hynix's semiconductor concept snack "HBM Chips" and also presented the book "Super Momentum," which contains the company's growth story.

The following day, he met CEO Tan at Broadcom's headquarters in San Jose to share the mid- to long-term outlook for the memory market and supply strategies, as well as the investment portfolios of the two companies. Based on the HBM technology collaboration the two companies have built up so far, response strategies related to next-generation AI chip architectures and memory integration technologies were dealt with as core agenda items. In a structure where Broadcom provides customized AI accelerators and networking solutions to global big tech customers and SK hynix maximizes system performance through HBM, the two sides engaged in in-depth discussions on new design and packaging approaches for the simultaneous optimization of next-generation HBM and AI-dedicated chips.

Mark Zuckerberg, Meta CEO (left), and Choi Taewon, Chairman of SK Group (right). SK Hynix Newsroom

On the 10th, Chairman Chey then visited Seattle to meet CEO Nadella. This move is intended to expand cooperation with MS beyond semiconductors into AI infrastructure and service domains, thereby broadening SK hynix's position within the global AI ecosystem. The two sides shared the current status of collaboration and future vision surrounding "Maia 200," MS's recently unveiled in-house AI accelerator. SK hynix is seeking to secure a stable demand base through long-term HBM supply to MS, while at the same time reviewing ways to expand the scope of cooperation to various AI semiconductors in the future.

On the same day, Chairman Chey also met with CEO Zuckerberg. SK hynix is already a key partner supplying enterprise solid-state drives (SSDs) and server DRAM to Meta's data centers, and the two sides aligned their views on optimizing the company's HBM for Meta's MTIA platform used for AI accelerator development.

On the 11th, at the Google campus in San Jose, Chairman Chey and CEO Pichai put their heads together over long-term cooperation on AI memory supply. The two agreed that the key bottleneck in building AI data centers lies in securing memory, and that stabilizing long-term supply and demand is crucial because rapid capacity expansion is difficult. At the meeting, SK hynix proposed expanding the scope of cooperation across the entire mid- to long-term AI chip roadmap, including joint design of customized HBM aligned with Google's next-generation AI model and Tensor Processing Unit (TPU) architecture roadmap, and collaboration on future TPU products based on HBM4.