Unveiled Side by Side at the Semiconductor Exhibition on October 22
First Public Showcase in Korea... Highlighting AI Memory Technologies
Three-Way HBM4 Competition with Micron... Samples Supplied to Nvidia
SK Hynix Also Displays PIM, eSSD, and GDDR
Samsung Presents Exynos 2500 for Flip Integration
Materials, Components, and Equipment Companies Draw Attention... Exhibition Continues Through the 24th
SK Hynix and Samsung Electronics, both competing for the lead in the global high-bandwidth memory (HBM) market, showcased their next-generation HBM4 12-Stack products to the public for the first time in Korea, highlighting their technological prowess.
The actual SK Hynix HBM4 12-Stack product displayed at the booth on-site at the 27th Semiconductor Exhibition held at COEX, Samseong-dong on the 22nd. Photo by Kim Hyungmin
On October 22, at the 27th Semiconductor Exhibition (SEDEX 2025) held at COEX in Samseong-dong, Gangnam-gu, Seoul, both companies set up display areas at the center of their booths to feature the actual HBM4 12-Stack products. Among the 280 participating companies, they occupied the largest booths-SK Hynix in Hall D and Samsung Electronics in Hall C. SK Hynix presented not only the physical HBM4 12-Stack product but also models and videos explaining the product's structure. Samsung Electronics displayed both the HBM3E 12-Stack and HBM4 12-Stack products side by side, emphasizing that the company is pioneering advanced technologies in HBM.
SK Hynix and Samsung Electronics are fiercely competing with Micron of the United States to supply HBM4 to Nvidia. All three companies have provided Nvidia with samples of their HBM4 12-Stack products and are awaiting feedback. Depending on Nvidia's decision, the products will soon undergo quality verification tests (qual tests), after which the final supplier will be determined. There are reported differences in design approaches between SK Hynix and Samsung Electronics. SK Hynix utilized a 10-nanometer class, fifth-generation 1b process for its product, while Samsung Electronics opted for a 10-nanometer class, sixth-generation 1c process. SK Hynix believed that HBM4 could be sufficiently developed and mass-produced using the 1b process without taking unnecessary risks, whereas Samsung Electronics took on the challenge of the more advanced 1c process to achieve a superior product. The industry expects that which approach proves correct will become clear once Nvidia makes its supply decision.
Real products of Samsung Electronics' HBM3E 12-stack and HBM4 12-stack displayed at the booth on-site at the 27th Semiconductor Exhibition held at COEX, Samseong-dong on the 22nd. Photo by Kim Hyungmin
At the exhibition, both companies also presented a range of memory and non-memory technologies and products essential for the AI era, beyond just HBM4. SK Hynix showcased graphics DRAM (GDDR), processor-in-memory (PIM), and high-performance enterprise solid-state drives (eSSD). Samsung Electronics drew attention by displaying the actual Exynos 2500 smartphone application processor, which is expected to be fully integrated into the Galaxy Z Flip 7. The company also introduced its foundry (semiconductor contract manufacturing) process technologies, which have gained momentum through orders from global companies such as Tesla and Apple.
Materials, components, and equipment companies also attracted visitors by presenting their flagship products. Hanmi Semiconductor introduced its new 'TC Bonder 4' equipment for HBM4 production, as well as the '2.5D Big Die TC Bonder' and 'Big Die FC Bonder'-used in AI logic semiconductors-at a domestic exhibition for the first time.
The Semiconductor Exhibition will continue through October 24 under the theme 'Beyond Limits, Connected Innovation.' The Korea Semiconductor Industry Association announced that the event will showcase two key strategies for the semiconductor industry in the AI era: overcoming the physical limitations of existing technologies and organically connecting the entire ecosystem to accelerate innovation. The keynote speeches will feature three leading figures representing technology, policy, and the ecosystem, who will outline the direction of Korea's semiconductor industry. On the opening day, October 22, Samsung Electronics CTO Song Jaehyuk will present on 'Semiconductor Innovation through Synergy,' Chung-Ang University Distinguished Professor Sung Yunmo (former Minister of Trade, Industry and Energy) will discuss 'Trends in Semiconductor Industry Hegemony Competition and Policy Recommendations,' and Lee Jin-an, CEO of Amkor Technology Korea, will address 'Advanced Packaging Leadership in the Semiconductor Ecosystem,' all providing a roadmap for the semiconductor industry in the AI era.
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