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SK Hynix has begun the world's first mass production of the 5th generation HBM3E 12-layer product with a maximum capacity of 36GB, the largest among existing high-bandwidth memory (HBM). This is seen as another demonstration of technological prowess just six months after delivering the industry's first HBM3E 8-layer product in March.
Image of SK hynix 36GB 5th generation high-bandwidth memory HBM3E 12-stack product. [Photo by SK hynix]
On the 26th, SK Hynix announced that it has started mass production of the 36GB HBM3E 12-layer product. The capacity has increased by 50% compared to the previous maximum HBM3E capacity of 24GB, and the company claims to have achieved world-class levels in all aspects essential for AI memory semiconductors, including speed, capacity, and reliability.
According to SK Hynix, the operating speed of this product has been raised to 9.6Gbps (gigabits per second), the highest speed among existing memories. When four of these products are installed in a graphics processing unit (GPU) and run Meta's large language model (LLM) 'LLaMA 3 70B,' it can read all 7 billion parameters 35 times per second.
SK Hynix stated that it plans to supply the product to customers within this year. Although the supplier's name was not disclosed, the industry interprets this as meaning it will be supplied to leading global AI chip companies such as NVIDIA.
Kim Ju-seon, head of AI infrastructure at SK Hynix, said, "We have once again broken technological limits and proven our position as a unique AI memory leader leading the era. We will continue to steadily prepare next-generation memory products to overcome the challenges of the AI era and maintain our status as the 'global No. 1 AI memory provider.'"
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