[Featured Stock] Gigavis Rises on Domestic Major Companies' 'Love Call' for Glass Substrate Inspection Solutions

Gigavis is showing strong performance. This is interpreted as being influenced by reports that the company received a love call for its glass through-via (TGV) inspection solution from a major domestic conglomerate.

As of 2:39 PM on the 3rd, Gigavis is trading at 44,300 KRW, up 13.75% compared to the previous day.

According to a media outlet, Gigavis recently confirmed that L Corporation, a major domestic parts and materials company, requested Gigavis to inspect ultra-fine holes (Via holes) generated during the semiconductor stacking process related to glass substrate samples it is developing. Currently, Gigavis is in the final stages of developing the TGV inspection solution.

To manufacture glass substrates, bare glass suitable for the substrate characteristics is required. Circuits are engraved on the bare glass, and to electrically connect them, holes that allow electricity to pass between the glass layers must be drilled. The most mainstream technology used to create these pathways (Via Holes) is TGV technology.

Due to the rapid spread of artificial intelligence (AI), global semiconductor giants are actively competing to secure glass substrates, known as the "dream substrate."

L Corporation, along with SKC and Samsung Electro-Mechanics, is accelerating the commercialization of glass substrates. To this end, they have begun full-scale commercialization by exploring collaboration with material, parts, and equipment partners. They have also cooperated with group companies to secure initial technologies such as glass processing.