"We are preparing to supply semiconductor equipment not only domestically but also to overseas companies. Having proactively engaged in research and development (R&D), we are confident that we possess differentiated technology related to semiconductor glass substrates. We plan to become a global leading company."
Philoptics stated this on the 15th after attending the 'Glass Substrate Corporate Day' hosted by NH Investment & Securities at Park One in Yeouido on the 12th. Corporate Day is an event where companies, institutional investors, and analysts meet and exchange ideas.
Four companies, including Philoptics, were invited to this Corporate Day. Philoptics was the last presenter. The company disclosed its business plans for its core business, display, as well as new growth engines including ▲semiconductors ▲solar energy sectors. They provided detailed explanations about semiconductor glass substrate manufacturing equipment, which holds the key to their next leap forward.
Last month, Philoptics became the first in the industry to supply TGV (Through Glass Via) mass production equipment. This shipment of mass production equipment marked a turning point for Philoptics to advance as a semiconductor equipment company.
In semiconductor glass substrate processing, Philoptics has a product lineup that includes not only TGV but also ▲DI (direct imaging) exposure equipment that forms circuit patterns without masks ▲laser ABF drilling for processing micro-holes ▲singulation equipment that separates glass substrates into individual units. Having built a portfolio capable of handling multiple process steps allows them to respond swiftly to customer requests.
Glass substrates are emerging as next-generation semiconductor package substrates. They have the advantage of being processed into large rectangular panels with smooth and hard surfaces, making them easy to handle. They enable ultra-fine line width packaging. Since an interposer itself is not required, the substrate thickness can be reduced. As the packaging area expands, performance is ultimately dramatically enhanced. Leading domestic and international companies such as ▲Intel ▲Samsung Electronics ▲Samsung Electro-Mechanics ▲SKC have announced large-scale investments related to glass substrates.
A Philoptics representative said, "TGV and singulation equipment require advanced technology to drill holes and cut glass substrates. Since we have internalized laser-based display processing technology from the company's inception, we are confident that Philoptics' unique know-how will be well integrated into the semiconductor glass substrate sector."
© The Asia Business Daily(www.asiae.co.kr). All rights reserved.
