[Featured Stock] Nepes, On-Device AI 'Dark Horse'... Developing Semiconductors Equipped with Deep Learning Acceleration IP

Nepes is showing strength. The news of successfully developing the intelligent semiconductor for edge computing, 'METIS,' appears to be influencing the stock price.

As of 2:04 PM on the 27th, Nepes is trading at 19,800 KRW, up 5.26% from the previous day.

Nepes Artificial Intelligence Research Institute was selected as the lead company for the project "Development of Intelligent Edge Computing Semiconductor for Lightweight Manufacturing Inspection Equipment" under the AI Semiconductor Application Technology Development Project led by the Institute for Information & Communications Technology Planning & Evaluation (IITP) under the Ministry of Science and ICT in April 2021. The industry-academia-research consortium involving Nepes included the Korea Electronics Technology Institute and Hanyang University.

The research team developed a deep learning model based on an automatic lightweight software framework aiming for ultra-lightweight, miniaturization, low power consumption, and low cost of existing server or PC-based manufacturing inspection systems. Furthermore, they completed a deep learning acceleration IP optimized for data reuse and parallel computation processing, which was integrated into METIS.

Nepes secured low-power SoC platform technology incorporating a neural network-based deep learning defect detection algorithm that can reorganize existing server-centric AI systems into device-centric ones.

Additionally, METIS applied Nepes' advanced 2.5D & 3D package platform nePACTM's cx-BGA (Ball Grid Array). nePACTM is a next-generation advanced packaging technology implementing multi-layer and fine RDL wiring based on fan-out technology and flip-chip bonding technology, suitable for highly integrated, high-performance chips such as AI semiconductors.

Park Yeon-sook, the lead researcher at Nepes Artificial Intelligence Research Institute, stated, "We have secured intelligent processor technology capable of defect detection at the edge while resolving network traffic issues in existing cloud server-based systems," adding, "This will accelerate the development of various deep learning-related applications needed across industries."

Previously, in April 2020, Nepes was selected as the lead institution for the project "Development of Mobile Self-Learning Recursive Neural Network Processor Technology" under the Ministry of Science and ICT's 'Next-Generation Intelligent Semiconductor Technology Development Project' and has been conducting research. Multiple institutions, including the Korea Electronics Technology Institute, Chungbuk National University, Hanyang University, and Seoul National University of Science and Technology, are collaborating to secure core technologies enabling lightweight semi-supervised learning and distributed learning by embedding learning functions within devices to optimize privacy of personal and security data and user environments.

Based on its AI design technology, Nepes has developed not only foundational AI semiconductor technologies specialized for on-device applications such as 'mobile self-learning' and 'AI semiconductor lightweighting' but also an integrated AI platform technology for on-device AI.

Lead researcher Park Yeon-sook said, "The on-device AI semiconductor market is blossoming," and added, "AI semiconductors capable of learning at the device level have limitless application fields in our daily lives." She further noted, "The project outcomes will secure foundational technologies for advancing on-device AI technology."

Moreover, Nepes is undertaking various national projects to develop core technologies for system semiconductors and AI semiconductor packaging based on its advanced packaging manufacturing technologies, including the Ministry of Science and ICT-led 'Development of Chiplet Heterogeneous Integration Ultra-High-Performance AI Semiconductors' with a total project cost of 44 billion KRW, and the Ministry of Trade, Industry and Energy-led 'Development of Core Materials and Process Technologies for 3D IC Manufacturing Using FOWLP.'

Nepes is a key partner of Samsung Electronics' advanced packaging (AVP). To foster advanced packaging, Samsung established the AVP (Advanced Packaging) team at the end of last year and is strengthening cooperation with technologically capable partners. Having supplied advanced packaging services since the 2000s, Nepes participated as a key partner of Samsung in the 'Next-Generation Semiconductor Packaging Equipment and Materials Industry Exhibition,' showcasing its technologies such as high-quality WLP processes, FOPLP, and the ultra-compact SiP nePAC.