Doosan Expands CCL Marketing to Japan Following Europe and US... Participates in 'Nepcon Japan'

Introduction to New Businesses Such as PFC and Antenna Modules

[Asia Economy Reporter Choi Seoyoon] Doosan Corporation has strengthened its marketing efforts in the Japanese market this year, following Europe and the United States.

Doosan Corporation announced that it will participate in ‘NEPCON JAPAN 2023,’ held in Tokyo, Japan, for three days starting from the 25th. The company plans to actively seek business cooperation partners within Japan, attract new customers, and expand orders.

Now in its 37th year, ‘NEPCON JAPAN 2023’ is Asia’s largest exhibition for electrical and electronic design research and development (R&D) as well as manufacturing and packaging technologies. Approximately 1,400 companies are participating.

At this exhibition, Doosan Corporation will introduce its core product, copper-clad laminate (CCL) manufacturing technology and product lineup, along with new businesses such as Patterned Flat Cable (PFC) connecting electric vehicle battery cells, 5G antenna modules, and Micro-Electro-Mechanical Systems Oscillators (MEMS Oscillators).

CCL is a printed circuit board (PCB) material used in electronic device components such as smartphones, 5G communication equipment, data centers, and chipsets.

Doosan Corporation’s core product, CCL, is mainly composed of a copper foil layer, resin, and a reinforcing substrate forming an insulating layer. Among these, the resin composition ratio determines the performance of both the CCL and the printed circuit board (PCB). Since 1974, the Electronics BG has accumulated about 50 years of experience and know-how to create resin compositions with overwhelming performance.

Last year, the company also developed PTFE (Polytetrafluoroethylene) resin material. PTFE resin is an insulating layer with ultra-low loss characteristics, mainly applied in special industries such as aerospace and aviation. When used in CCL for communication network boards, it can meet high-spec demands such as ultra-high frequency (mmWave) and 6G.

With this technological capability, Doosan Corporation showcases a full lineup of CCL products including PTFE resin-based automotive radar CCL, ▲ package CCL that electrically connects semiconductor chips and mainboards while protecting semiconductors, ▲ mobile device memory semiconductor CCL that drastically reduces warpage caused by differences in thermal expansion coefficients of different materials, and ▲ wireless communication equipment CCL with low dielectric constant and low loss characteristics that reduce signal loss and enable stable transmission and reception of large amounts of data.

In addition, the company will introduce PFC, a material connecting the smallest unit of electric vehicle batteries, cells, which can also be expanded to door, seat, and roof cables; 5G antenna modules (operating in 28GHz, 26GHz, and 39GHz frequency bands), which are core components of communication devices such as 5G wireless repeaters and small cells; and the world’s first MEMS oscillator that outputs two frequencies from a single device with excellent frequency stability.

A Doosan Corporation official stated, “We will continue active marketing activities to introduce various product lines to the Japanese market, secure new customers, and discover business partners who can create business synergies.”