[Asia Economy Reporter Hyungsoo Park] Hanmi Semiconductor announced on the 5th that it has started supplying the ‘hMR Dual TC Bonder 1.0,’ an essential process equipment for broadband memory (HBM3) produced by attaching semiconductor chips made with TSV technology onto wafers, to global semiconductor companies.
Hanmi Semiconductor Vice Chairman Dongshin Kwak introduced, "The hMR Dual TC Bonder is a cutting-edge bonding equipment that produces HBM3 semiconductors (broadband memory chips), which are essential for implementing GPUs that play a core role in future semiconductors such as AI semiconductors."
He added, "It has recently attracted the most attention as the starting point for the growth of the AI semiconductor market, which requires vast amounts of data and fast processing speeds, such as supercomputers and big data-based machine learning."
Furthermore, he emphasized, "We supplied customers with about four times higher productivity and precision compared to competitors by consolidating Hanmi Semiconductor’s 42 years of know-how and technology. As global IT companies such as Nvidia and AMD increasingly adopt HBM3 as a key memory chip for implementing AI semiconductors, we expect continuous orders for the essential process equipment, the hMR TC Bonder."
Founded in 1980, Hanmi Semiconductor succeeded in domestic production of the semiconductor package cutting (SAW) equipment called ‘Micro Saw’ in June 2021. It received the ‘IR52 Jang Young-sil Award’ in April and was the only Korean semiconductor company selected as one of the ‘Top 10 Semiconductor Equipment Companies in the World for Customer Satisfaction in 2022’ by the global semiconductor research firm Tech Insights Inc. in May.
According to data released in June by the World Semiconductor Trade Statistics (WSTS), the overseas semiconductor market size is expected to reach $646.5 billion (approximately 845 trillion KRW) this year. It is forecasted to grow by 5.1% next year as well.
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