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Hanmi Semiconductor Recruits Former Apple Executive Myungho Lee, a Global Semiconductor Expert

Expanding Global Clients and Strategic Collaboration
A Veteran with 25 Years of Experience in Semiconductors
Expertise from Leading Companies Including TI and Amkor

Hanmi Semiconductor has recruited Myungho Lee, a semiconductor expert formerly with global big tech company Apple, as its new Vice President.


On January 14, Hanmi Semiconductor announced the appointment of Vice President Lee, a semiconductor specialist with experience at Apple. At Hanmi Semiconductor, Vice President Lee will oversee development and sales, focusing on strengthening new product and technology development. The company also plans to further solidify its business by expanding its global client base and pursuing strategic collaborations.


Vice President Lee is a veteran with over 25 years of experience in the semiconductor field, having played key roles at leading global semiconductor companies such as Apple, Texas Instruments (TI), JCET and StatsChipPAC, and Amkor Technology. Drawing on hands-on experience across product development, process technology, quality, and manufacturing, he has led the development and mass production of a wide range of advanced semiconductor packaging technologies, from lead frame to integrated fan-out (INFO).


Hanmi Semiconductor Recruits Former Apple Executive Myungho Lee, a Global Semiconductor Expert Myungho Lee, Vice President of Hanmi Semiconductor. Hanmi Semiconductor

At Apple, Vice President Lee worked for about 10 years starting in 2014, leading semiconductor packaging development for application processors (AP) used in major products such as the iPhone, Apple Watch, and iPad, as well as overseeing the development of battery management units (BMU). During this time, he also demonstrated his technological competitiveness by holding a U.S. patent related to EMI shielding.


Previously, at Texas Instruments (TI), he worked for about 10 years from 2004 as an engineering manager, leading various global projects including those for Nokia. He spearheaded next-generation packaging technology development and was appointed as a technical specialist (MGTS) for the first time among outsourced development organizations.


At JCET and StatsChipPAC, he served as product development team leader, leading program development with global clients such as Nvidia, Broadcom, and IBM. At Amkor Technology, he achieved outstanding results in packaging and materials technology development.


A Hanmi Semiconductor representative stated, "The addition of Vice President Myungho Lee will be a significant turning point in elevating our global customer response capabilities and next-generation semiconductor technology competitiveness. We expect this will further strengthen our position in the global market."


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