Samsung Electronics' 6th generation high-bandwidth memory (HBM), HBM4, has passed a key milestone for application in Google's next-generation artificial intelligence (AI) chips. Industry analysts say that, after outperforming competitors in performance tests conducted by Broadcom, which is responsible for Google’s AI semiconductor design, the likelihood of HBM4 being adopted in actual Google chips has significantly increased.
The actual models of Samsung Electronics' 6th generation high-bandwidth memory, HBM4 and HBM3E, are on display. Photo by Yonhap News
According to the semiconductor industry on December 31, Samsung Electronics' HBM4 recently achieved an operating speed in the mid-11 gigabits per second (Gbps) range during a system-in-package (SiP) test conducted with Broadcom. This is reported to be the fastest among global memory manufacturers. It is also said to have received higher scores than competitors in stability assessments, including heat control.
The SiP test is a process in which an AI chip and high-bandwidth memory are combined into a single package to evaluate their performance and stability under real-world conditions. This is essentially the final verification stage before mass production of AI semiconductors, and the results of this test determine whether the memory will be selected for use.
Broadcom is a key partner exclusively responsible for the design of Google’s Tensor Processing Units (TPUs). Google sets the performance targets for TPUs, while Broadcom handles the actual design and component validation. For this reason, a strong evaluation in Broadcom’s test greatly increases the likelihood that the memory will be used in Google TPUs.
The results of this latest test are interpreted as confirming that Samsung Electronics' HBM4 has secured high performance and stability in the environment of Google’s 8th generation TPU, which is expected to be commercialized next year.
Samsung Electronics and Broadcom have been collaborating in the high-performance memory and AI semiconductor sectors since 2023. Industry experts believe that, with this achievement, Samsung Electronics is now in a favorable position in the competition to supply HBM for next-generation AI semiconductors.
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