Samsung Electronics HBM4 Passes Broadcom Validation, Raising Hopes for Supplying Next-Generation Google AI Semiconductors

Samsung Electronics' 6th generation high-bandwidth memory (HBM), HBM4, has passed a critical milestone for application in Google's next-generation artificial intelligence (AI) chips. Industry analysts suggest that, after outperforming competitors in Broadcom's performance tests for Google's AI semiconductor design, HBM4 is now highly likely to be adopted in actual Google chips.

The actual models of Samsung Electronics' 6th generation high-bandwidth memory, HBM4 and HBM3E, are on display. Photo by Yonhap News

According to the semiconductor industry on December 31, Samsung Electronics' HBM4 recently recorded an operating speed in the mid-11 gigabits per second (Gbps) range during a system-in-package (SiP) test conducted with Broadcom. This is reported to be the fastest among global memory manufacturers. HBM4 also received higher marks for stability, including thermal management, compared to its competitors.

The SiP test is a procedure that combines the AI chip and HBM into a single package to evaluate performance and stability under real-world usage conditions. It serves as the de facto final verification stage before mass production of AI semiconductors, and the results of this test determine whether the memory will be adopted.

Broadcom is a key partner exclusively responsible for designing Google's Tensor Processing Units (TPUs). Google sets the performance targets for TPUs, while Broadcom handles the actual design and component verification. Therefore, a strong evaluation in Broadcom's test significantly increases the likelihood that the memory will be used in Google's TPUs.

The results of this test confirm that Samsung Electronics' HBM4 delivers high performance and stability even in the environment of Google's 8th generation TPU, which is expected to be commercialized next year.

Samsung Electronics and Broadcom have been collaborating in the fields of high-performance memory and AI semiconductors since 2023. Industry experts believe that, with this achievement, Samsung Electronics is now well positioned to gain a competitive edge in supplying HBM for next-generation AI semiconductors.