"Hanmi Semiconductor Secures 71% Global Market Share in TC Bonders This Year"

Citing TechInsights Market Research
"TC Bonder Market to Rebound Next Year, 13% Annual Growth Projected"

According to a recent report, Hanmi Semiconductor has maintained its position as the global leader in the high bandwidth memory (HBM) TC bonder market, securing a 71.2% market share by revenue through the third quarter of this year.

On December 22, Hanmi Semiconductor cited the '2025 TC Bonder Market Report' recently released by global semiconductor market research firm TechInsights to announce these results. Hanmi Semiconductor's cumulative revenue through the third quarter reached 247.7 million dollars (approximately 366 billion KRW), followed by SEMES (13.1%), ASMPT (5.6%), and Yamaha Robotics (5.6%).

TechInsights Aggregate HBM TC Bonder Sales and Market Share. Hanmi Semiconductor

In 2017, Hanmi Semiconductor became the first in the world to launch the 'TSV Dual Stacking TC Bonder.' The TC bonder is a core piece of equipment that precisely bonds memory chips at high temperature and high pressure during the HBM manufacturing process. As demand for artificial intelligence (AI) semiconductors surges, the HBM market is expanding, and the TC bonder has become essential equipment for global memory companies.

Hanmi Semiconductor possesses all the fundamental technologies for TC bonders used in HBM production, including both non-conductive film (NCF) type and mass reflow-molded underfill (MR-MUF) type. The company holds a total of 150 patents related to HBM equipment, including those pending application. In July of this year, Hanmi Semiconductor established a mass production system for 'TC Bonder 4,' equipment for HBM4 (6th generation), and plans to launch the next-generation 'Wide TC Bonder' for HBM by the end of next year. Additionally, the company is investing 100 billion KRW to build a hybrid bonder factory in the Juan National Industrial Complex in Seo-gu, Incheon, aiming for completion by the end of next year.

With the growth of the HBM market, demand for TC bonders is expected to continue rising. In its report, TechInsights stated, "After a short-term normalization process in 2025, the TC bonder market is expected to rebound in earnest from 2026," and projected, "The market will show strong growth with a compound annual growth rate (CAGR) of about 13% through 2030."