"Hanmi Semiconductor Secures 71% Global Market Share in TC Bonders This Year"

Citing TechInsights Market Research
"TC Bonder Market to Rebound Next Year, 13% Annual Growth Projected"

According to a recent report, Hanmi Semiconductor has maintained its position as the global leader in the high bandwidth memory (HBM) TC bonder market, securing a 71.2% market share by revenue through the third quarter of this year.

On December 22, Hanmi Semiconductor cited the '2025 TC Bonder Market Report' recently released by global semiconductor market research firm TechInsights to announce these results. Hanmi Semiconductor's cumulative revenue through the third quarter was tallied at 247.7 million dollars (approximately 366 billion won), followed by SEMES (13.1%), ASMPT (5.6%), and Yamaha Robotics (5.6%).

TechInsights Aggregate HBM TC Bonder Sales and Market Share. Hanmi Semiconductor

In 2017, Hanmi Semiconductor became the first in the world to launch the 'TSV Dual Stacking TC Bonder.' TC bonders are essential equipment in the HBM manufacturing process, precisely bonding memory chips at high temperatures and high pressures. As demand for artificial intelligence (AI) semiconductors surges, the HBM market has grown, making TC bonders indispensable for global memory companies.

Hanmi Semiconductor possesses all the core TC bonder technologies for HBM production, including both non-conductive film (NCF) type and mass reflow-molded underfill (MR-MUF) type. The number of patents related to HBM equipment, including those planned for application, totals 150. In July of this year, the company established a mass production system for 'TC Bonder 4,' equipment for HBM4 (6th generation), and plans to launch the next-generation 'Wide TC Bonder' for HBM by the end of next year. In addition, Hanmi Semiconductor is investing 100 billion won to build a hybrid bonder factory in the Juan National Industrial Complex in Seo-gu, Incheon, aiming for completion by the end of next year.

With the growth of the HBM market, demand for TC bonders is expected to steadily increase. In its latest report, TechInsights stated, "After a temporary normalization process for TC bonders in 2025, a full-fledged rebound is expected to begin in 2026," forecasting a strong compound annual growth rate (CAGR) of about 13% through 2030.