Hanmi Semiconductor Chairman Kwak Dongshin to Acquire Additional 6.2 Billion KRW in Company Shares, Confident in HBM TC Bonder Technology

Hanmi Semiconductor announced on December 5 that Chairman Kwak Dongshin plans to acquire company shares worth 6.2 billion KRW.

The planned acquisition date is December 30, about a month from now, and the shares will be purchased on the open market. Upon completion, Chairman Kwak Dongshin will have personally acquired a total of 53.48 billion KRW worth of company shares (686,157 shares) since 2023. His ownership stake will increase from 33.51% to 33.56%, a rise of approximately 0.05 percentage points.

Chairman Kwak Dongshin's additional share purchase is seen as a decision reflecting his confidence in the technological capabilities of Hanmi Semiconductor's TC Bonder in the high-bandwidth memory (HBM) equipment market and in the company's recent achievements.

Hanmi Semiconductor holds the number one global market share in TC Bonder equipment, which is essential for producing HBM, a core component of AI semiconductors. Since 2002, the company has focused on strengthening its intellectual property and has continued to expand its technological competitiveness, filing more than 130 patents related to HBM equipment to date.

Hanmi Semiconductor expects to maintain its leadership in the HBM4 market, which global memory manufacturers will begin mass-producing next year, by supplying its 'TC Bonder 4' equipment. By the end of next year, the company will launch the 'Wide TC Bonder' to support the production of 'Wide HBM.' Wide HBM is a next-generation HBM that expands the DRAM die area to support greater memory capacity and faster data processing.

On November 18, the HBM TC Bonder was selected as a '2025 World-Class Product' by the Ministry of Trade, Industry and Energy and KOTRA. The company also received the '300 Million Dollar Export Tower' award at the 62nd Trade Day ceremony.