Doosan Establishes Carbon Footprint Assessment Solution 'DOO LCA'

Proactive Response to Carbon Emissions Management and Sustainable Management
Third-Party Verification Completed by Lloyd's Register Quality Assurance

Doosan has taken a further step toward sustainable management by establishing and verifying a carbon footprint assessment solution for its products.

Doosan's main product, Copper Clad Laminate (CCL). Doosan

On July 31, Doosan announced that it has developed a carbon footprint assessment solution called 'DOO Life Cycle Assessment (LCA)' for its key product, copper-clad laminate (CCL), and has completed third-party verification by Lloyd's Register Quality Assurance (LRQA), a global greenhouse gas verification organization. LCA is a method that quantitatively analyzes and evaluates the environmental impact of products and services throughout all stages, from raw material extraction to manufacturing, distribution, use, and disposal.

The third-party verification was conducted based on the international standards for carbon footprint calculation, 'ISO 14040:2006, ISO 14044:2006, and ISO 14067:2018.'

This solution enables the data collection and systematic management of carbon emissions generated throughout the entire product lifecycle, including raw material procurement, manufacturing, transportation, use, and disposal. It is also integrated with the company's internal IT systems for enhanced convenience, and has been designed with scalability in mind to accommodate various conditions such as process changes and the expansion of the CCL product lineup.

CCL is a core material for printed circuit boards (PCBs) and is used in a wide range of applications including semiconductors, network boards for telecommunications equipment, mobile devices, and wearable devices. In particular, CCL for artificial intelligence (AI) accelerators features low dielectric and low loss characteristics, allowing for high-speed delivery of large volumes of data even in high-frequency domains. As a result, it has attracted significant attention from global AI semiconductor companies.

A Doosan representative stated, "This is the first time we have measured the carbon footprint of our products and established a related solution," and added, "By systematically managing the carbon emissions of our products through 'DOO LCA,' we will proactively respond to the sustainability requirements of global IT clients and further strengthen our position in the market."