SK Key Foundry and LB Semicon Jointly Develop 'Direct RDL'

Core 8-Inch Semiconductor Packaging Technology
Enhanced Chip-to-Substrate Connectivity and Minimized Signal Interference
Production Efficiency Maximized Through Combined Technologies of Both Companies

SK Key Foundry, a foundry (semiconductor contract manufacturing) company, announced on July 15 that it has jointly developed and successfully completed reliability evaluation of 8-inch-based core semiconductor packaging technology, Direct RDL (Redistribution Layer), with LB Semicon. As a result, the company is set to further advance next-generation semiconductor packaging technology and strengthen its competitiveness in automotive semiconductor products.

RDL refers to the formation of metal wires and insulating layers for electrical connections on top of semiconductor chips, and is mainly applied in WLP (Wafer Level Packaging) and FOWLP (Fan-Out Wafer Level Packaging) processes. It serves to enhance connectivity between the chip and substrate while minimizing signal interference.

The Direct RDL developed by SK Key Foundry and LB Semicon has achieved a wiring thickness of up to 15μm (micrometers, one millionth of a meter) and a wiring density covering up to 70% of the chip area. This makes it suitable for power semiconductors with current capacity, not only for mobile and industrial applications but also for automotive use.

Furthermore, the technology meets the Auto Grade-1 rating of the AEC-Q100 international automotive semiconductor quality standard, which evaluates operational reliability in harsh environments, supporting an operating temperature range from -40°C to +125°C. This enables support for automotive products, setting it apart from competitors. By providing design guides and development kits, the company can now offer process solutions with the small chip sizes, low power consumption, and affordable packaging costs that customers require.

LB Semicon, a company specializing in semiconductor packaging and testing, expects to significantly shorten development time by leveraging SK Key Foundry's comprehensive understanding of semiconductor processes and advanced manufacturing capabilities. The company also stated that maximizing production efficiency is expected through the optimized wafer-level formation of Direct RDL, achieved by combining its own back-end processes with SK Key Foundry's foundry process technology.

Kim Namseok, CEO of LB Semicon, said, "This has become an important opportunity to enhance the technological competitiveness between SK Key Foundry and LB Semicon," adding, "Through close cooperation between the two companies, we plan to secure leadership in the next-generation semiconductor packaging market based on high reliability."

Lee Dongjae, CEO of SK Key Foundry, stated, "The joint development with semiconductor packaging specialist LB Semicon is significant in that it integrates our advanced manufacturing capabilities across the entire semiconductor process into the development of cutting-edge semiconductor packaging processes." He added, "SK Key Foundry will continue to advance through ongoing collaboration with LB Semicon, a semiconductor specialist, to firmly establish itself as a top-tier foundry for power semiconductors in the semiconductor market."