Chairman Kwak Dongshin: "Hanmi Semiconductor to Lead HBM4 and HBM5 Markets with TC Bonder"

On July 15, Hanmi Semiconductor Chairman Kwak Dongshin dismissed some views suggesting a transition to hybrid bonders for HBM4 and HBM5 production, emphasizing, "Introducing hybrid bonders for HBM4 and HBM5 production is a case of 'using a bull knife to slaughter a chicken' (우도할계, Udohalgy)."

The price gap between hybrid bonders and TC bonders is so significant that Chairman Kwak cited the idiom Udohalgy, meaning "using a bull knife to slaughter a chicken," as an example.

Chairman Kwak stated, "A hybrid bonder costs over 10 billion KRW per unit, which is more than twice the price of a TC bonder. Since JEDEC relaxed the AI packaging thickness standard to 775μm in April, both HBM4 and HBM5 can now be manufactured using Hanmi Semiconductor's TC bonder. Therefore, I believe customers will not choose the hybrid bonder, which costs more than twice as much."

He continued, "Hanmi Semiconductor has held the number one global market share in HBM TC bonders since 2024, currently capturing a 90% share in the HBM3E market for Nvidia. We aim to achieve a 95% market share in the HBM4 and HBM5 markets by the end of 2027."

He added, "We are developing a hybrid bonder for HBM6, targeting a launch by the end of 2027, to proactively prepare for the market. We plan to maintain our continuous market leadership." He also stated, "The fluxless bonder is on our roadmap and may be launched as early as within this year."

Chairman Kwak expressed confidence, saying, "Hanmi Semiconductor possesses all thermal compression bonding technologies for HBM production, including NCF and MR-MUF types, and holds the world's best technology in this field."

Hanmi Semiconductor also highlighted the advantages of its vertically integrated production system (In-house System). Chairman Kwak explained, "By managing the entire process internally, from design and parts processing to software, assembly, and inspection, Hanmi Semiconductor has secured a differentiated competitive edge in technological innovation, production optimization, and cost management that other equipment manufacturers cannot easily match."

The company also clearly presented its global market position and customer response strategy. He said, "With the growth of the global AI market and increasing demand for HBM, I am confident that demand for high-end bonders for HBM production will rise significantly. To respond to this demand, we are actively investing in technology development and expanding production capacity."

Founded in 1980, Hanmi Semiconductor is a global semiconductor equipment company with approximately 320 customers worldwide. Since establishing its Intellectual Property Division in 2002, the company has focused on protecting and strengthening its intellectual property rights, filing a total of about 120 HBM equipment patents to date.