Hanmi Semiconductor Launches Dedicated TC Bonder 4 Team "Silver Phoenix"

Hanmi Semiconductor announced on June 5 that it has launched the dedicated TC Bonder 4 team, "Silver Phoenix."

The Silver Phoenix team, which operates the TC Bonder 4 at Hanmi Semiconductor, consists of more than 50 skilled semiconductor equipment specialists. The team was formed to respond quickly to the diverse technical requests of client companies.

To ensure that the TC Bonder 4 team can provide safe and prompt premium services even during the winter, the company is strategically supporting the team with 30 eco-friendly hybrid four-wheel-drive (4WD) silver-colored SUVs.

The Silver Phoenix team will be deployed to clients' production facilities, where they will be responsible for the maintenance and optimization of the TC Bonder 4 equipment, which is essential for producing HBM, the core of AI semiconductors.

Previously, Hanmi Semiconductor became the first in the industry to launch the "TC Bonder 4" equipment for HBM4 last month. The "TC Bonder 4" is a dedicated device capable of producing HBM4 and features significantly improved productivity and precision compared to previous models, specifically tailored to the higher precision requirements of HBM4. Through this, the company expects to actively respond to the mass production of HBM4 by global memory manufacturers and the increasing demand for AI semiconductors from big tech companies in the second half of this year.

A Hanmi Semiconductor representative stated, "By launching the dedicated TC Bonder 4 team, Silver Phoenix, we will provide premium services and make every effort to maximize customer satisfaction."

Founded in 1980, Hanmi Semiconductor is a global company with unrivaled experience and expertise in the semiconductor industry, serving approximately 320 clients worldwide. As the world's leading producer of TC Bonders for HBM production, the company has maintained and developed original technologies. Since establishing its Intellectual Property Department in 2002, Hanmi Semiconductor has secured a total of about 120 patents related to HBM equipment to date.