Key Equipment for HBM Production Process
Some TC Bonders Deployed On-Site, Full-Scale Operation Begins
"Frequent Equipment Inspections, Will Collaborate Closely"
Hanwha Semitek, which will supply mass-production TC bonders to SK Hynix, is establishing an 'Advanced Packaging Technology Center' near SK Hynix for collaboration.
On the 28th, Hanwha Semitek announced that it had established a rapid response system by opening an advanced packaging technology center in Bubal-eup, Icheon, Gyeonggi Province, near the SK Hynix site. This is the first time that a separate technology center has been set up near the site to support advanced packaging customers, including TC bonders.
Previously, Hanwha Semitek signed a supply contract to deliver mass-production TC bonders to SK Hynix. After signing two contracts in March with SK Hynix, each worth 21 billion KRW, totaling 42 billion KRW for TC bonder supply, Hanwha Semitek also signed another TC bonder supply contract on the 16th of this month. The total contract amount known from the first order in March to this month has reached 80.5 billion KRW.
The TC bonder is a key piece of equipment in the production process of high-bandwidth memory (HBM), an AI memory installed in AI accelerators. The yield of HBM depends heavily on the technological capabilities of the TC bonder, making it critical. Hanwha Semitek explained that some TC bonders have already been deployed on-site and have begun full-scale operation.
The Icheon technology center was established to support the stable operation of TC bonders deployed on site. Due to the high technical complexity and intricate processes involved with TC bonders, support from specialized personnel is essential.
A Hanwha Semitek representative stated, "Since this is the initial deployment phase, it is important to frequently check the condition of the equipment," and added, "The center's role is to enhance production efficiency through systematic management and rapid response." The representative continued, "With the establishment of our own technology center near the site, more systematic cooperation with clients has become possible," and added, "We will continue various forms of collaboration with clients through ongoing communication."
Hanwha Semitek's TC bonder development and service personnel will be stationed at the Icheon technology center. Their main tasks will include: ▲ initial equipment installation and inspection ▲ process operation ▲ response to unexpected situations ▲ reflecting customer requirements. Hanwha Semitek plans to continuously expand its network of technology centers to maintain close collaboration with clients.
Hanwha Semitek has been researching and developing semiconductor equipment for over 30 years. Based on advanced flip-chip bonding technology, the company began developing TC bonders in 2020 and succeeded in entering the market in just over four years. In February of this year, Hanwha Semitek announced an expansion of research and development (R&D) investment along with a change of company name, and recently established a dedicated organization for next-generation semiconductor equipment development. The company plans to focus on developing next-generation technologies such as hybrid bonders to lead the global semiconductor equipment market.
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