YCChem Passes Mass Production Evaluation for EUV Rinse

On May 21, semiconductor materials company YCChem announced that its independently developed 'Extreme Ultraviolet (EUV) Rinse' product has passed mass production evaluation by a global semiconductor company.

A company representative stated, "We are currently discussing product supply schedules and other details with our global clients," and added, "YCChem will directly supply essential materials for high-difficulty semiconductor manufacturing processes, including high-bandwidth memory (HBM)."

The 'EUV Rinse' that YCChem is beginning to supply plays a key role in improving resolution, roughness, and sensitivity in semiconductor EUV processes, while preventing pattern collapse and adhesion issues that can occur due to the short wavelength of the light source. The company emphasized that its product is competitive because it can effectively reduce pattern collapse and defects that occur during DRAM processing.

It can contribute to improving the final yield in HBM production. In the HBM packaging process, where DRAM chips are vertically stacked, the stability of the rinse material is a core variable that directly affects yield.

YCChem is also beginning full-scale mass production of three core materials for glass substrates. The company is already mass-producing TSV PR (Through Silicon Via Photoresist), a material essential for the HBM process. Based on its technological capabilities and process stability, YCChem plans to secure substantial growth opportunities across next-generation industries such as AI, autonomous driving, and high-performance computing.

A YCChem representative said, "Recently, the semiconductor industry has been actively introducing EUV lithography technology into advanced sub-10-nanometer processes," and added, "The application areas are also rapidly expanding from traditional logic semiconductors to memory such as DRAM."