Research Agreement Ceremony Held at Hanyang University Seoul Campus
Effective Design of Semiconductor Package and Heat Dissipation Components Anticipated
On May 12, LX Semicon, a fabless (design-specialized) semiconductor company, announced that it will collaborate with Hanyang University to develop semiconductor packaging heat dissipation technology and foster specialized talent in the field.
LX Semicon and Hanyang University held a research agreement ceremony at Hanyang University Seoul Campus New Main Building for the research and development of semiconductor and power semiconductor packaging heat dissipation technology and workforce training. President Yoon Tae Lee (left) of LX Semicon and President Ki Jung Lee of Hanyang University signed the research agreement and took a commemorative photo. Photo by LX Semicon
Recently, LX Semicon and Hanyang University signed a research agreement at the New Main Building of Hanyang University’s Seoul campus for the research and development of semiconductor and power semiconductor packaging heat dissipation technology, as well as workforce training. The signing ceremony was attended by Hanyang University President Ki Jung Lee, Advanced Semiconductor Packaging Research Center Director Hak Sung Kim, and LX Semicon President and CEO Yoon Tae Lee.
Through this research, LX Semicon expects to enable effective design of heat dissipation components used in semiconductor and power semiconductor packages. The company also anticipates that implementing robust, high-performance heat dissipation solutions for advanced packages will strengthen its competitiveness in the semiconductor packaging market and increase customer trust. LX Semicon also plans to focus on nurturing semiconductor professionals. The company intends to actively recruit master's and doctoral talent by offering internships and industry-academia scholarships to engineering students at Hanyang University.
President Lee stated, "I hope that Hanyang University's advanced packaging technology will contribute to the technological advancement and business of LX Semicon, and serve as a cornerstone for the growth of Korea's semiconductor packaging technology." President Lee also emphasized, "If LX Semicon’s semiconductor design capabilities and heat dissipation technology are combined with advanced semiconductor packaging technology, we expect to maximize customer value. We will also operate talent development programs to actively recruit outstanding professionals."
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