Mirae Industry, a company specializing in semiconductor back-end process equipment, announced on May 7 that it has developed an 'All-In-One Carrier' that will bring innovation to next-generation high-bandwidth memory (HBM) testing methods, and has completed patent applications in Korea, the United States, and China.
HBM is a core semiconductor component essential for the advancement of artificial intelligence (AI) technology, and its importance within the industry has been increasing recently. The conventional HBM testing methods include wafer-level testing (Probe Tester) and die carrier methods. Mirae Industry is currently producing samples using the latter method.
The 'All-In-One Carrier' adopts a glass substrate test socket (Glass Socket) made of glass, which is emerging as a next-generation material instead of the conventional silicon substrate, significantly improving the precision contact and stability of HBM dies. As a result, it can be applied to the semiconductor manufacturing process simply by modifying the test equipment, greatly reducing investment costs for customers and maximizing efficiency in terms of maintenance as well.
Recently, Mirae Industry successfully produced the first sample of the 'All-In-One Carrier,' completing precision verification and HBM die contact tests, and has also finished producing a second sample for customer validation, which is currently undergoing internal testing. In addition, the company has completed domestic patent applications for the related technology and has also filed for overseas patents.
A representative from Mirae Industry stated, "We are accelerating the development of the new fourth-generation handler 'Quantum,' which is related to the 'All-In-One Carrier' technology. The new Test Handler is a core technology to further enhance HBM testing efficiency, and both domestic and international patent applications have been completed," adding, "We expect this development to serve as a new leap forward in realizing our vision of becoming a world-class global company."
The company has been supplying Test Handler equipment for an extended period to major global semiconductor companies such as S Company, Infineon, Changxin Memory Technologies (CXMT), and Yangtze Memory Technologies (YMTC).
Meanwhile, two years ago, Mirae Industry was acquired by Nexton Bioscience, a major subsidiary of SL Energy (now Roa&Co). Nexton Bioscience, the largest shareholder of the company, currently holds 21,847,748 shares (32.31%).
Roa&Co's affiliates include Studio Santa Claus, Nexton Bioscience, Mirae Industry, EV Advanced Materials, Dynamic Design, and SC Engineering.
© The Asia Business Daily(www.asiae.co.kr). All rights reserved.
