LG Electronics Expands AI Data Center 'Thermal Management Solution'... First Participation in DCW

Unveiling Cooling Solution Lineup Including CDU
Reducing Installation Space and Improving Energy Efficiency
Applying Virtual Sensor Technology to Detect Sensor Failures

LG Electronics is set to actively expand its data center cooling solution business by leveraging its HVAC (Heating, Ventilation, and Air Conditioning) technology. The company plans to accelerate its market penetration in the rapidly growing data center market in the AI era by focusing on liquid cooling technology.

LG Electronics announced that it will participate for the first time in 'Data Center World (DCW) 2025,' held from the 14th to the 17th (local time) in Washington D.C., USA. At this exhibition, LG Electronics will showcase a variety of cooling solution lineups, including data center-dedicated liquid cooling solutions (CDU), strengthening its approach to the global business-to-business (B2B) market.

DCW is a global exhibition attended by big tech companies and semiconductor firms, featuring seminars and business meetings on topics such as artificial intelligence (AI) technology, infrastructure construction, and energy efficiency.

The CDU introduced by LG Electronics attaches cold plates to high-heat chips such as central processing units (CPU) and graphics processing units (GPU) inside servers, circulating cooling water. Compared to traditional air cooling, it reduces installation space and improves energy efficiency. LG Electronics has realized CDU stability and high efficiency based on its core component technology.

Liquid cooling solution that directly cools the heat of chips inside the data center, LG Electronics CDU (Cooling Distribution Unit), provided by LG Electronics

In particular, by applying virtual sensor technology, the system operates stably by utilizing data from other sensors even if key sensors fail. Additionally, the pump equipped with high-efficiency inverter technology automatically adjusts the cooling water supply to maximize energy efficiency. LG Electronics plans to complete CDU development within the first half of the year and begin full-scale supply to global AI data center customers within the year.

Air cooling solutions will also be showcased. LG Electronics' 'Oil-Free Inverter Turbo Chiller' applies magnetic bearing technology that levitates the motor shaft in the air using electromagnetic force, enhancing energy efficiency. The company will also unveil the 'FWU (Fan Wall Unit)' product, which precisely controls airflow.

LG Electronics proposes a hybrid cooling solution optimized for data center structures. This method combines liquid cooling and air cooling, providing customized solutions for AI data center environments characterized by high power and high heat.

Alongside this, the company will introduce the building integrated management solution 'BECON' system. Through AI-based real-time energy analysis, it precisely analyzes temperature and power usage within buildings and automatically controls systems to help reduce energy consumption.

Recently, LG Electronics established an 'AI Data Center HVAC Solution Lab' testbed at its Pyeongtaek chiller factory to verify the performance of cooling solutions such as CDU, chillers, and FWU. The company is also researching the 'immersion cooling' method, which involves directly submerging server equipment in insulating liquid.

The ES (Eco Solution) Business Division, newly established at the end of last year to expand the HVAC business, is also actively operating. The division plans to aggressively pursue new growth business opportunities including AI data center cooling systems, nuclear power plants, and mega factories.

Lee Jae-sung, Vice President and Head of LG Electronics' ES Business Division, said, "LG Electronics is a prepared player with various AI data center cooling solutions, including large-scale chillers and CDUs. We will accelerate B2B business growth based on differentiated HVAC technology."