[Click eStock] "Protec, New Equipment Laser Bonder Expected"

Daishin Securities predicted on the 3rd that Protek's new equipment, the laser bonder, will act as a catalyst for stock price growth.

Jangwook Park, a researcher at Daishin Securities, stated, "Protek is supplying laser reflow equipment utilizing laser technology," and explained, "Laser reflow is a technology that replaces the heat source of conventional reflow equipment, which melts bumps during the bonding process, from hot air to laser."

He added, "As semiconductor miniaturization and stacking processes progress, wafer warpage is gaining attention," and "the need for laser technology capable of performing miniaturization processes, including laser reflow, is increasing." Furthermore, he emphasized, "Protek has developed laser bonder equipment that performs both laser reflow and bonding, and has delivered demos to overseas foundry companies," adding, "The laser bonder equipment can perform the bonding process through localized melting, welding, and fusion of not only bumps but also various bonding materials and substrate materials."

He described it as "equipment competing with TC bonders," and explained, "The existing dispenser equipment market size is 1 trillion KRW, while the target market size for laser bonder equipment reaches 3 trillion KRW."

Researcher Park expressed, "The future direction of the company's stock price will be determined depending on whether full-scale mass production of the laser bonder begins," and expected, "Considering the process technology trends of semiconductor miniaturization and stacking, the need for laser-based technology equipment will gradually increase."

It is estimated that Protek will achieve sales of 176.4 billion KRW and an operating profit of 25.8 billion KRW this year, representing increases of 3.6% and 92.5%, respectively, compared to last year.