[Click eStock] "DI to Verify Wafer Inspection Equipment for HBM4"

Hana Securities analyzed on the 12th that DI will deliver HBM4-oriented wafer inspection equipment samples to customers and proceed with equipment verification.

Researcher Kwon Tae-woo of Hana Securities explained, "HBM4 requires improvements in inspection equipment precision and performance due to technical changes such as increased stacking and improved power efficiency," adding, "burn-in test times are lengthening, and bottlenecks within the inspection process are likely to intensify."

He continued, "DI plans to supply HBM4-oriented sample equipment to customers within this month," and "Japanese and domestic competitors are also preparing for deliveries."

He introduced, "In the past, during the selection of HBM3 equipment, DI was confirmed as a supplier of DDR5/HBM3 wafer inspection equipment for SK Hynix together with a Japanese equipment company." Furthermore, he predicted, "DI will secure a favorable position in the selection of new HBM4 equipment suppliers by leveraging its technology and reliability."

Researcher Kwon estimated, "This year, DI is expected to achieve sales of 450.6 billion KRW and an operating profit of 54 billion KRW," analyzing that "these figures represent increases of 114% and 1836%, respectively, compared to last year." He added, "Overall, a favorable environment is being created for DI," and "mid- to long-term growth drivers are expected to be strengthened."