Hanmi Semiconductor Achieves Record High Performance Since Establishment... Last Year's Sales Reach 558.9 Billion Won

Hanmi Semiconductor announced on the 3rd that it recorded sales of 558.9 billion KRW and an operating profit of 255.4 billion KRW based on consolidated financial statements last year. This is the largest scale since its establishment.

Founded in 1980, Hanmi Semiconductor has produced various semiconductor equipment for 44 years and supplied them to overseas customers. When it was listed on the KOSPI market in 2005, its sales were only 79 billion KRW. The sales scale has grown about eightfold over 20 years.

A Hanmi Semiconductor official explained, "Hanmi Semiconductor is creating a semiconductor equipment production cluster with a total area of 89,530㎡ (27,083 pyeong) and 7 factories in the Juan National Industrial Complex, Seo-gu, Incheon," adding, "We produce HBM production TC bonders, MSVP for semiconductor packages, EMI shield equipment, and grinders."

He continued, "Through the consumables production line for equipment, we have established a system capable of mass production up to 2 trillion KRW in sales," adding, "We have a vertically integrated system that directly handles everything from design, parts processing, software, assembly, to inspection processes without outsourcing."

While continuing external growth, the advantage is the ability to deliver quickly to customers. We provide equipment at reasonable prices and have superior competitiveness compared to competitors.

The official said, "The artificial intelligence (AI) market continues rapid changes and growth," and predicted, "The HBM market will grow explosively every year."

Hanmi Semiconductor is expected to play a leading role in HBM3E 12-layer used by Nvidia and Broadcom, which lead the global AI market, as well as in the launch of HBM4 and HBM5 with its TC bonders, FLTC

bonders (fluxless type), and hybrid bonders.

Due to the expansion of the AI market and customer demands, we plan to supply big die bonders for 2.5D to customers in the Chip on Wafer on Substrate (CoWoS) market. We are also preparing EMI shield equipment applicable to smart devices and satellite communication devices through frequency changes, and MSVP for glass substrate cutting to respond to the opening of the glass substrate market.

The official emphasized, "Ultimately, as the AI semiconductor market diversifies, the biggest beneficiary will be HBM," adding, "The demand for Hanmi Semiconductor’s proprietary technology, the advanced package bonder for memory stacking, will continue to increase."

Hanmi Semiconductor is a global company with about 320 customers worldwide, based on its unparalleled experience and know-how in the global semiconductor market. Since establishing the Intellectual Property Department in 2002, it has focused on protecting and strengthening intellectual property rights through a team of about 10 experts, and has filed over 120 patents related to HBM equipment to date. With its outstanding technology and durability, it is expected that the competitiveness of its equipment will be further enhanced.