[Special Stock] C&G HiTech Rises on Start of Prototype Facility Operation for Semiconductor 'Glass Substrate'

C&G Hightech is showing strong performance. This is interpreted as being influenced by recent news that the company has established and started operating a demo facility capable of producing prototypes based on core original technologies related to glass substrates.

As of 1:21 PM on the 23rd, C&G Hightech is trading at 12,150 KRW, up 3.93% compared to the previous day.

Glass PCB replaces the substrate material from conventional silicon or polymer materials with glass, which has excellent electrical insulation and heat resistance. It is characterized by being heat-resistant and having high power efficiency while reducing thickness during the semiconductor packaging process. Additionally, it minimizes circuit distortion.

However, since glass has a smooth surface and chemical resistance, securing adhesion strength with copper metal above a certain standard is essential.

It is also necessary to fill copper metal into the through-holes connecting circuits between the front and back surfaces of the glass to form fine electrode pathways. In particular, the higher the aspect ratio (ratio of diameter to depth) of the processed hole entrance, the more fine circuit connection pathways can be formed per unit area of the glass substrate, enabling the implementation of high-density circuit boards.

This demo facility enables high adhesion between copper and glass on a large area of 510x515mm through high-efficiency M-PVD deposition technology and original glass surface treatment technology, and allows the formation of copper thin films on the inner walls of through-holes with an aspect ratio of 1:5.

The produced glass substrates have higher thermal and mechanical stability compared to existing substrates and can integrate more transistors in a single package. Next-generation semiconductors applying this technology are expected to be prioritized for use in high-performance applications such as data centers, artificial intelligence (AI), and graphics, and the industry has already entered a competition to secure market leadership.