Veteran engineer Lin Jun-cheng, a former TSMC employee, is reported to have left Samsung Electronics at the end of last year upon contract expiration.
According to industry sources on the 1st, Vice President Lin, who worked as an executive in charge of the Next Generation Research Lab at the Semiconductor Research Institute under the Device Solutions (DS) division CTO of Samsung Electronics, resigned as of December 31 last year.
Vice President Lin is an expert in semiconductor packaging who worked at TSMC from 1999 to 2017. Before joining Samsung Electronics, he served as the CEO of the Taiwanese semiconductor equipment company Skytech.
At the beginning of 2023, Samsung Electronics established the Advanced Packaging (AVP) organization responsible for packaging-related technology and product development, and recruited Vice President Lin. The contract period was two years.
On the 31st of last month, Vice President Lin posted on LinkedIn, "Today is my last day at Samsung Electronics as my two-year contract ends," adding, "I am pleased to have contributed to both the company and my career development by applying Samsung’s advanced packaging technology, and the past two years have been an enjoyable and meaningful journey."
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