Hanmi Semiconductor Chairman Kwak Dong-shin Launches TC Bonder Griffin Super Bonding

Hanmi Semiconductor launched the 'TC BONDER GRIFFIN SB 1.0,' a new piece of equipment for producing next-generation High Bandwidth Memory (HBM) used in artificial intelligence (AI) semiconductors, on the 16th.

Along with the product launch, Vice Chairman Gwak Dong-shin was promoted to Chairman for the first time in 17 years. Chairman Gwak has been with Hanmi Semiconductor for over 26 years since joining in 1998, leading the company's growth.

Chairman Gwak has devoted himself to prioritizing customer satisfaction by continuously investing in research and development and providing differentiated products and services. He has worked to build a company with a simple yet systematic structure. He established a system to complete semiconductor equipment through meticulous and thorough processes.

To produce one piece of equipment at Hanmi Semiconductor, a master craftsman with over 25 years of experience must perform six rounds of inspections at each stage, including processing, assembly, wiring, and testing, undergoing a total of 1,000 inspections. Under Chairman Gwak’s leadership, Hanmi Semiconductor succeeded in developing the TC bonder, an essential process equipment for AI semiconductor HBM. The company has become a leading Korean semiconductor equipment firm with a market capitalization exceeding 8 trillion KRW.

Chairman Gwak Dong-shin explained, "With the rapid growth of the AI market, the global HBM market is increasing explosively every year," adding, "NVIDIA’s next-generation product, Blackwell, a leader in AI semiconductors, is also produced using Hanmi Semiconductor’s TC bonder." He continued, "Hanmi Semiconductor, holding the world’s number one market share for HBM TC bonders, maintains its status and competitiveness without change," and introduced, "The newly launched TC BONDER GRIFFIN SUPER BONDING HEAD is a new TC bonder product for next-generation HBM production."

He said, "By applying the new bonding head, productivity and precision in stacking semiconductor chips have greatly improved," and added, "It will significantly contribute to increased sales next year as it is actively utilized by semiconductor customers worldwide for next-generation HBM production."

Chairman Gwak stated, "In preparation for the expanding demand in the AI-dedicated chip market of major U.S. big tech companies, we are establishing a U.S. corporation and selecting agents capable of providing after-sales service (A/S) to local customers in the U.S., who are emerging as key customers in the AI semiconductor market," he added.

Hanmi Semiconductor signed a trust contract for acquiring treasury shares worth 200 billion KRW this year. Over the past three years, the company has signed trust contracts totaling 280 billion KRW to enhance shareholder value. Chairman Gwak personally acquired approximately 37.3 billion KRW worth of treasury shares directly from the market since last year, expressing confidence in Hanmi Semiconductor’s future value.