ICCH Accelerates Commercialization of Thermal Control Material with 'Insulation Function for AI Semiconductors'

ICH, a high-performance advanced composite material specialist company, announced on the 11th that it is accelerating the commercialization of high-functionality heat control materials as a new growth engine.

Heat control materials are heat dissipation and insulation materials that can solve the heat generation problem of mobile devices. Considering that the on-device integration of artificial intelligence (AI) semiconductors, high integration of chips, and miniaturization of devices have made solving heat issues a key topic, investments are being expanded as a next-generation growth engine.

The first new material being prepared for commercialization is a special insulation material for AI semiconductors. With the expansion of AI functions, the need for insulation materials that block heat as well as semiconductor heat dissipation is increasing, and a sharp rise in demand is expected.

ICH possesses manufacturing technology for porous structures essential for insulation materials through years of polyurethane (PU) foam production. By adding newly developed materials with low thermal conductivity, the company plans to secure excellent insulation performance and enhance price competitiveness by utilizing existing production lines.

The company is also preparing to commercialize a new material that replaces the metal mesh of vapor chambers used for heat dissipation of mobile application processors (AP) in smartphones. This new material achieves metal mesh-level heat dispersion through plating or surface treatment on fabric textiles while reducing thickness to less than 30 microns (㎛), half of the existing thickness. A plating line using fabric instead of expensive metal wires has been established, improving cost competitiveness.

A company official said, "With the on-device integration of AI semiconductors, demand for high-performance insulation and heat dissipation materials that can solve heat problems will surge," adding, "We expect the new materials to rapidly replace existing ones through high performance and price competitiveness achieved by internalizing core processes."

He continued, "We are also preparing the development and commercialization of new materials that require heat management centered on power semiconductors, displays, and batteries," emphasizing, "These new materials improve durability and can reduce thermal runaway and fire risks."