[Click eStock] "Hanmi Semiconductor, Dual TCB Orders Expected to Increase"

Hyundai Motor Securities forecasted on the 18th that next year, the dual TCB orders for Hanmi Semiconductor will increase due to the expansion of high-bandwidth memory (HBM) capacity.

Minjung Kwak, a researcher at Hyundai Motor Securities, stated, "The third-quarter performance is understood to have an actual operating profit margin higher than the announced operating profit margin due to the increased sales proportion to overseas clients," adding, "Next year, as HBM capacity expansion continues, dual TCB orders will steadily increase, becoming a core competitive advantage for the company."

She expected sales of Big Die Bonder to increase, driven by strong demand for cloud artificial intelligence (AI) accelerators. She emphasized, "Thanks to strong demand for cloud AI accelerators, the global demand for CoWoS packaging is expected to grow by 113% annually by 2025," and added, "Major suppliers such as TSMC, ASE, SPIL, and Amkor are actually expanding CoWoS capacity, with TSMC's monthly production capacity expected to increase to over 65,000 12-inch wafers by the end of the fourth quarter next year."

She continued, "Digitimes also reported that combining the production capacities of Amkor and ASE will increase to 17,000 units," explaining, "Accordingly, Hanmi Semiconductor's Big Die Bonder, which is essential for AI 2.5D packages, is expected to significantly contribute to performance growth next year."