12·16GB Package Thickness 0.65mm
Made by Stacking 12nm-Class DRAM 4 Times
Thermal Resistance Improved by 21.2%
Samsung Electronics announced on the 6th that it has started mass production of the industry's thinnest 12-nanometer class low-power double data rate (LPDDR) 5X DRAM 12GB and 16GB packages. The thickness of this product is 0.65 mm, making it the thinnest among existing LPDDR DRAMs of 12GB or more.
Samsung Electronics stacked the industry's smallest 12-nanometer class LPDDR DRAM in four layers and optimized package technology, package circuit substrates, and EMC (epoxy molding compound) technology to reduce the thickness by about 9% compared to the previous generation product and improve thermal resistance by about 21.2%. In addition, by maximizing the technology of the back-lap process, one of the package processes, the wafer was made as thin as possible to realize the minimum thickness package.
The reduced thickness of this product allows for additional free space, which induces smooth airflow and helps control the internal temperature of the device.
Generally, on-device AI, which requires high performance, activates a temperature control function that limits performance when the device temperature exceeds a certain range due to heat generation. By equipping this product, the activation time of this function caused by heat generation can be delayed as much as possible, minimizing device performance degradation such as speed reduction and screen brightness dimming.
Samsung Electronics plans to continue supplying optimized solutions that meet customer demands in the on-device AI era by developing 24GB modules based on a 6-layer structure and 32GB modules based on an 8-layer structure as the thinnest LPDDR DRAM packages in the future.
Byoung-chul Bae, Vice President and Head of Product Planning at Samsung Electronics’ Memory Business Division, said, "As demand for high-performance on-device AI increases, not only the performance of LPDDR DRAM but also the capability to improve temperature control has become important. Samsung Electronics will continue to develop low-power DRAMs that are thinner than existing products and provide optimized solutions through close cooperation with customers."
Samsung Electronics plans to timely supply this 0.65mm LPDDR5X DRAM to mobile application processors and mobile companies to further expand the low-power DRAM market.
Meanwhile, market research firm Omdia forecasted that mobile DRAM installed in high-performance smartphones will increase about 2.16 times from 7.02GB per unit last year to 15.22GB in 2028. Samsung Electronics has maintained the No. 1 position in mobile DRAM sales for 12 consecutive years from 2012, when Omdia began compiling data, through the first quarter of this year. Samsung Electronics’ mobile DRAM market share in the first quarter of this year was 57.9%.
© The Asia Business Daily(www.asiae.co.kr). All rights reserved.
