DIE is showing strength. It appears that securities firms' analysis expecting benefits from localization due to the shortage of high-bandwidth memory (HBM) testing equipment has had an impact.
As of 10:16 AM on the 23rd, DIE was trading at 20,400 KRW, up 610 KRW (3.08%) compared to the previous trading day.
Researcher Chayongho from Ebest Investment & Securities said, "One of the current difficulties in expanding HBM production capacity (CAPA) is the shortage of capacity from Advantest and Teradyne, which dominate the test equipment market," adding, "Domestic HBM suppliers are promoting localization to resolve the shortage of test equipment supply."
He explained, "HBM wafer test equipment requires higher current compared to general DRAM equipment, but the subsidiary DF has already supplied DDR5 burn-in equipment to SK Hynix, so its technological capability is considered proven," and added, "We are currently discussing upgrading the existing DDR5 test equipment for the mass production of HBM3e with SK Hynix, and developing dedicated equipment starting from HBM4."
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