Suwon City Recruiting Exhibitors for the '2024 Next-Generation Semiconductor Packaging Industry Expo'

The city of Suwon in Gyeonggi Province has decided to operate a joint pavilion at the ‘2024 Next-Generation Semiconductor Packaging Industry Exhibition’ (ASPS 2024) and will recruit participating companies from the 25th of this month until the 9th of next month.

Co-hosted with Gyeonggi Province, this event will be held at the Suwon Convention Center from August 28 to 30.

The event will include an exhibition, company-specific technical seminars, an international forum introducing domestic and international semiconductor packaging trends and technology developments (Semiconductor Packaging Trend Forum), and export consultation meetings.

Promotional Poster for Suwon City's '2024 Next-Generation Semiconductor Packaging Industry Exhibition'

Suwon City will select rising companies in the semiconductor packaging field to operate the Suwon City joint pavilion at the Next-Generation Semiconductor Packaging Industry Exhibition. Semiconductor packaging materials, parts, and equipment (SoBuJang) companies located in Suwon are eligible to participate.

Suwon City will select participating companies based on evaluations of stability, proactiveness, and distinctiveness. Selected companies will be provided with two promotional booths and basic operational supplies.

This year’s Next-Generation Semiconductor Packaging Industry Exhibition plans to expand participation from semiconductor packaging companies from leading countries in the semiconductor industry such as Taiwan, the United States, and Japan. The Seoul Taiwan Trade Center (TAITRA) and the American Chamber of Commerce (AMCHAM) will support participating companies in expanding overseas.

Packaging is the process of manufacturing semiconductor chips into forms suitable for electronic devices. It is the only way to overcome the limitations of ultra-fine processes.

A Suwon City official stated, "Last year, we successfully operated the Suwon City joint pavilion composed of the Suwon City investment policy promotion booth and booths from local companies (DK&C, SWC). We hope the Suwon City joint pavilion will serve as a platform to discover companies in the semiconductor packaging field and help companies secure new business opportunities."

Meanwhile, at the ‘2023 Next-Generation Semiconductor Packaging Industry Exhibition’ held at the Suwon Convention Center in August last year, 91 companies and institutions including Samsung Electronics, SK Hynix, ASMPT, Protek, Sungkyunkwan University, Pyeongtaek University, and Ajou University participated, operating 276 booths and exhibiting semiconductor packaging test equipment and assembly equipment.