The Ministry of Trade, Industry and Energy announced on the 9th that it will newly launch the 'Next-Generation Aerospace High-Reliability Communication Network Semiconductor Technology Development Project' with a total budget of 30 billion KRW starting this year to develop ultra-high-speed communication semiconductors used in next-generation aircraft. This project is scheduled to be carried out in three phases from this year until 2028.
Through this project, the government plans to secure core intellectual property rights (IP) for aerospace communication network semiconductors, which currently rely on overseas technology, and establish a comprehensive aerospace semiconductor ecosystem covering design → foundry → demonstration and testing. It will also promote integration into overseas demand and supply chains through collaboration with global aerospace companies.
In this regard, during President Yoon Seok-yeol's visit to the United States in April last year, the Korea Institute for Advancement of Technology and the Korea Institute for Industrial Technology Promotion signed a memorandum of understanding (MOU) with the U.S. aerospace company Boeing, agreeing that if Korea develops aerospace semiconductors, Boeing will cooperate in demonstration testing regarding specifications and quality.
Detailed project announcements can be found on the Ministry of Trade, Industry and Energy’s website and the Industrial Technology Research and Development (R&D) Information Portal. The application period is from the 9th to the 24th of this month.
The Ministry stated, "We will continuously support the development of necessary technologies to expand domestic semiconductor technological capabilities from existing system semiconductors focused on mobile, data centers, and home appliances to the aerospace sector, aiming to leap forward as a true aerospace powerhouse."
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