[Featured Stock] DI, HBM Equipment Delivery Expected... AI Semiconductor Value Chain 'Dark Horse'

DIE is showing strength. An analysis by a securities firm suggesting a high possibility of supplying equipment needed for the high-bandwidth memory (HBM) wafer testing process appears to be influencing the stock price.

As of 10:06 AM on the 5th, DIE is trading at 9,720 KRW, up 7.63% from the previous day.

Junyoung Park, a researcher at Hyundai Motor Securities, explained, "DIE is a company that supplies memory burn-in testers, memory wafer testers, inspection boards, and more," adding, "They are currently developing a wafer burn-in tester for HBM." He continued, "It is expected that the burn-in tester is highly likely to be supplied to the leading domestic HBM company," and added, "Currently, most wafer testers for HBM are understood to be Japanese Advantes products."

He also analyzed, "The price per unit of the equipment is generally understood to be more than twice that of domestic equipment," and "The HBM wafer testing process is divided into burn-in testing and final testing." He emphasized, "The burn-in tester is equipment with relatively lower technical difficulty," and "It is understood that the customer has a need for domestic production of the burn-in tester."

Researcher Park analyzed, "DIE plans to supply about 34 billion KRW worth of wafer testers for DDR5 to the customer this year," and "If the supply expands to HBM equipment as well, it will be a factor that sharply increases performance." He stated, "The expected completion time for the development of the HBM burn-in tester is between the second half of this year and the first half of next year."