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[Featured Stock] Philoptics Achieves First Domestic Success in AI Semiconductor Glass Packaging Core Equipment Up↑

Philoptics is showing strong performance. This is interpreted as being influenced by the news that it has developed the first domestically produced glass substrate cutting equipment used in semiconductor packaging.


As of 9:34 AM on the 26th, Philoptics is trading at 11,290 KRW, up 3.96% from the previous day.


According to the industry, Philoptics announced that it has developed equipment that uses laser technology to cut semiconductors packaged with glass substrates into individual chips. This is the first time that equipment for glass substrates has been domestically produced. Until now, it was reported that foreign equipment was relied upon. The company plans to actively promote supply to customers in the future.


Glass packaging substrates are known to be a hot topic in the semiconductor industry. Replacing plastic-based printed circuit boards (PCBs) with glass can reduce power consumption by more than 30%. Additionally, glass substrates have high stability, minimizing shrinkage or warping in heterogeneous integration, which maximizes semiconductor performance by connecting different chips. Glass substrates are advantageous for manufacturing AI semiconductors that connect graphics processing units (GPUs) and high-bandwidth memory (HBM) as a single semiconductor.


Philoptics developed the equipment anticipating the growth of the glass packaging substrate market. The industry expects the market size to expand to about 20 trillion KRW by 2027. Intel has made large-scale investments aiming for commercialization of glass packaging substrates by 2030. It invested 1 billion USD (approximately 1.3 trillion KRW) to establish a research and development (R&D) line in Chandler, Arizona, USA.


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