Costexis Receives Overseas 'Love Calls' for Core Power Semiconductor Materials like SiC and GaN... "Expansion After Expansion"

Costexis, a manufacturer of low thermal expansion high heat dissipation material components, announced on the 21st that it has signed an initial supply contract for high heat dissipation spacers for automotive power semiconductors with a global power semiconductor specialist company.

Costexis's high heat dissipation spacers for automotive use are key material components for next-generation compound power semiconductors such as SiC and GaN semiconductors, which have recently attracted market attention. They have been tested by several global semiconductor companies. With this first mass production order, the company has taken its first step into the global market.

Han Gyu-jin, CEO of Costexis, said, "We have been conducting many discussions and tests with leading domestic and international companies related to automotive power semiconductors," adding, "We were able to feel that the overall automotive power semiconductor market is accelerating as mass production orders proceeded faster than expected." He continued, "Although this is an initial contract with a small volume, it is meaningful as it represents an order in the mass production stage beyond the previous testing phase."

He also explained, "We have completed the expansion related to spacers at Plant 1 as planned, so there should be no difficulty in responding to the volume in the early mass production phase this year," and added, "To prepare for next year, when the market is expected to fully develop, we will also proceed smoothly with the expansion of production capacity at Plant 2 to ensure that there are no setbacks in promoting this core new growth engine business."

According to the trend of high integration and high output of next-generation power semiconductors such as SiC and GaN semiconductors, thermal matching?which efficiently dissipates heat generated in semiconductors to the outside and matches the thermal expansion coefficient of semiconductor devices?is an important factor. Interest in high heat dissipation materials and components is also growing in the market.