Signetics is showing strength. It is interpreted that this is influenced by the news that Samsung Electronics has embarked on developing new converged package technology to secure a 'super-gap' technology in the system semiconductor field.
As of 9:38 AM on the 24th, Signetics is trading at 1,397 KRW, up 4.8% compared to the previous day.
According to the industry, the day before, Samsung Electronics Semiconductor (DS) Division's newsroom published an article by Kang Moon-su, Vice President and Head of the Advanced Package (AVP) Business Team.
Vice President Kang stated, "To overcome the limits of semiconductor technology, 'Beyond Moore' beyond Moore's Law is necessary, and advanced package technology is the answer." By utilizing advanced package technology, heterogeneous integration technology that connects multiple semiconductors horizontally and vertically can integrate more transistors into a smaller semiconductor package, enhancing performance.
He added, "Samsung Electronics is the only company in the world that possesses ▲memory ▲logic foundry ▲package businesses all together," and said, "Leveraging these strengths, we will provide competitive 2.5D and 3D package products that connect cutting-edge logic semiconductors using extreme ultraviolet (EUV) lithography equipment and high-bandwidth memory (HBM) high-performance memory semiconductors into one through heterogeneous integration technology to the market and customers."
Meanwhile, Signetics operates a semiconductor packaging business that manufactures semiconductor electronic direct circuits, electrically connects chips, and seals them to withstand external shocks, giving them physical functions and shapes. It is known to have been trading with Samsung Electronics, SK Hynix, and others for over 10 years.
© The Asia Business Daily(www.asiae.co.kr). All rights reserved.
