Samsung: "The Latest Semiconductor Trend is 'Hyperconnectivity'... The Core of 'Beyond Moore'"

Slowing Increase in Semiconductor Integration Density Due to Physical Limits
"Moore's Law, Continued for Over 50 Years, Is Breaking"
Performance Improvement Expected with Advanced Packaging Technology

Samsung Electronics has identified advanced packaging technology as the key to overcoming the limitations of semiconductors. The company also announced plans to lead the market by introducing unprecedented products based on its proprietary packaging technology.

Kang Moon-soo, Vice President and Head of Samsung Electronics' Advanced Package (AVP) Business Team, posted an article with this content on the company's newsroom on the 23rd.

Vice President Kang explained that the industry is recently witnessing the breakdown of "Moore's Law." Moore's Law, announced in 1965 by Intel founder Gordon Moore, states that semiconductor integration density doubles every 24 months.

He pointed out that semiconductor companies have continued Moore's Law for over 50 years by developing technology that integrates fewer or more transistors on the same size chip. However, he explained that recently, as semiconductor process miniaturization has reached physical limits, the rate of increase in integration density has slowed compared to the past.

Kang Moon-soo, Vice President and Head of Samsung Electronics Advanced Package (AVP) Business Team /
[Photo by Samsung Electronics Newsroom]

Vice President Kang said, "With the advent of the smartphone, mobile internet, artificial intelligence (AI), and big data era, the required computing performance is rapidly increasing," adding, "Moore's Law is approaching its limit."

He also explained, "The market wants versatile semiconductors that integrate various functions such as analog and RF wireless communication into one. However, as the process is miniaturized, analog performance deteriorates, making it difficult to efficiently meet market demands through process miniaturization alone."

The semiconductor industry is seeking new methods beyond Moore's Law to overcome these technological limitations, known as "Beyond Moore." Vice President Kang identified "advanced packaging" as the core technology to lead the Beyond Moore era. Packaging is a heterogeneous integration technology that connects multiple semiconductors horizontally and vertically.

The market expects the advanced packaging market to grow at an average annual rate of 9.6% from 2021 to 2027. According to Vice President Kang, utilizing packaging technology allows more transistors to be integrated into smaller semiconductors, thereby enhancing performance.

To enhance its advanced packaging capabilities, Samsung Electronics established the AVP Business Team within its Device Solutions (DS) division, which is responsible for semiconductor business, in December last year. The AVP Business Team pursues an advanced packaging business model that provides customers with high-performance and high-efficiency solutions in a one-stop manner. Through this, it aims to advance the commercialization of customized advanced packaging technologies and solutions tailored to each customer and product.

Vice President Kang said, "The goal of the AVP Business Team is 'hyperconnectivity,'" adding, "Rather than simply adding the performance and functions of each semiconductor, we aim to create great synergy by connecting semiconductors to the world, connecting people to people, and connecting customers' imaginations to reality."

He also expressed his ambition, saying, "Samsung Electronics is implementing competitive development and production strategies, including possessing proprietary packaging technologies suitable for the trend of large-area substrates. We will become an AVP Business Team that enables unprecedented products through customer-centric business development."