Doosan Corporation Showcases Next-Generation Components Including 5G Antenna Modules and Semiconductor CCL at 'KPCA Expo'

KPCA Doosan Booth Rendering Image. Photo by Doosan Co., Ltd.

[Asia Economy Reporter Donghoon Jeong] Doosan Corporation announced on the 20th that it will participate in the 'International PCB and Semiconductor Packaging Industry Exhibition (KPCA show 2022)' held at Songdo Convensia, Incheon, from the 21st to the 23rd of this month.

At this exhibition, Doosan Corporation will showcase various copper-clad laminates (CCL) that can be used for 5G communications and semiconductors, as well as newly developed next-generation components.

The exhibition is the only and largest specialized exhibition related to PCB and semiconductor packaging in Korea, hosted by the Korea PCB & Semiconductor Packaging Industry Association. It was organized to introduce advanced technologies to workers in the PCB and semiconductor packaging industries, which are core to the electronics industry, and to provide opportunities for technology transfer and various information, thereby contributing to accelerating technological advancement and upgrading domestic equipment. This year, over 120 companies including Doosan Corporation, Samsung Electro-Mechanics, LG Innotek, and Mitsubishi Electric will participate.

Doosan Corporation will introduce 5G antenna modules, microelectromechanical system (MEMS) oscillators, and various types of CCL at this exhibition.

The 5G antenna module is a core component of 5G wireless repeaters applying beamforming antenna technology. It is an integrated solution module equipped with functions such as signal transmission and reception and frequency conversion. By utilizing beamforming antenna technology, signal interference between users can be minimized, and 5G signals can be transmitted in the desired direction, dramatically improving communication quality. Currently, it supports the 28 GHz frequency band used by all domestic mobile carriers, and 26 GHz and 39 GHz antenna modules are also under development for expansion into overseas markets such as China, Europe, and the United States.

The oscillator is a key component that generates internal signal frequencies for electronic devices and communication systems. The MEMS oscillator introduced by Doosan Corporation applies microfabrication technology from semiconductor manufacturing processes and features ▲ simultaneous transmission of two frequencies from a single device ▲ high durability against external shocks and electromagnetic waves ▲ stable performance despite temperature and humidity changes ▲ low power consumption. Additionally, due to its miniaturization and space efficiency, it is suitable for wearable and mobile devices.

Other exhibits include ▲ package CCLs that electrically connect semiconductor chips and mainboards and protect semiconductors ▲ CCLs for wired and wireless communication equipment used in servers and communication base stations ▲ flexible CCLs (FCCL) mainly used in smartphones and smartwatches. Newly developed low-loss CCLs and resin-coated copper foil (RCC) will also be introduced this year.

Yoo Seung-woo, Head of Doosan Corporation’s Electronics BG, said, "This exhibition is an opportunity not only to demonstrate the excellence of Doosan’s CCL products but also to actively promote new businesses and products to secure domestic and international customers and confirm new market entry possibilities." He added, "We will solidify our position as a specialized company in advanced electronic materials and components by proactively responding to market demands, increasing the proportion of high-end products, and expanding new businesses."