SKC to Establish Semiconductor Packaging 'Glass Substrate' Factory in the US

[Asia Economy Reporter Ryu Taemin] SKC is set to commercialize the world's first computing glass substrate it developed.

On the 28th, SKC held a board meeting and announced that it decided to invest a total of 80 million USD (approximately 93.6 billion KRW), including 70 million USD in technology value, to establish a glass substrate factory for semiconductor packaging in the state of Georgia, USA.

SKC plans to build a 12,000㎡ production facility and start mass production by 2023. The semiconductor substrates produced at the new factory will be high-performance computing glass substrates developed by SKC, which can enhance the performance and power efficiency of computer chipsets, making them a next-generation material attracting attention in the semiconductor packaging field.

Replacing existing plastic substrates with SKC glass substrates is expected to significantly reduce the thickness of semiconductor packages, cut power consumption by half, and dramatically improve data processing capacity.

SKC is also considering expanding production capacity to an annual 72,000㎡ scale by 2025.

A company representative stated, "We will establish a stable business foundation with various partners to supply global semiconductor manufacturers and contribute to the development of industries using high-performance semiconductors."