Oh Chang-yeol, Executive Director of Samsung Electro-Mechanics, Receives Presidential Citation on 'Electronics and IT Day'

Development of Core Semiconductor Package Substrate Technology Recognized for Enhancing Competitiveness of Korea's Substrate Industry

Oh Chang-yeol, Executive Director at Samsung Electro-Mechanics

[Asia Economy Reporter Kim Heung-soon] Samsung Electro-Mechanics announced that Oh Chang-yeol, General Manager of the Substrate Development Team (Executive Director), received the Presidential Citation at the awards ceremony of the "16th Electronics and IT Day" held at COEX on the 26th for his contribution to strengthening the competitiveness of Korea's semiconductor package substrate industry.

Executive Director Oh joined Samsung Electro-Mechanics in 1997 and developed core technologies for semiconductor package substrates, enhancing the competitiveness of the domestic substrate industry. Semiconductor package substrates connect semiconductor chips and mainboards (substrates), transmitting electrical signals and power while protecting the semiconductors.

In 2004, he developed the world's first semiconductor package substrate with a thickness of less than 130um (micrometers), contributing to the commercialization of thin NAND flash memory.

In 2009, he developed high-difficulty package substrates for mobile APs and improved production efficiency, helping Samsung Electro-Mechanics achieve industry leadership. He has also worked to strengthen the competitiveness of the domestic materials and components industry through win-win growth with partner companies via technological cooperation and fostering excellent talent through industry-academia collaboration.

Executive Director Oh said, "I want to share this honor with our engineers who worked hard and shared their passion to create the best products," adding, "We will continue to secure core technologies for cutting-edge semiconductor package substrates to contribute to the differentiation of semiconductor performance."

Samsung Electro-Mechanics, which started its substrate business in 1991, leads the substrate industry by supplying products to world-renowned companies. It holds the number one position in market share and technology for the highest-spec mobile AP semiconductor package substrates.

Meanwhile, the Electronics and IT Day event was established in 2005 to commemorate the achievement of $100 billion in electronics exports. It awards industrial medals, industrial decorations, Presidential Citations, Prime Minister Citations, and Ministerial Citations to those who have contributed to the development of the electronics and IT industry and the enhancement of national prestige.