Samsung Electronics Accelerates Preparation of Next-Generation Products Including cHBM and zHBM

President Song Jaehyuk Takes the Stage as First Keynote Speaker at Semicon Korea 2026
Presents an Integrated AI Architecture Encompassing Logic, Memory, and Packaging

On the 11th, Song Jaehyuk, President and Chief Technology Officer (CTO) of Samsung Electronics' Device Solutions (DS) Division, unveiled next-generation products and roadmaps and expressed his ambition to restore the company’s technological competitiveness. He stressed that, amid the current trajectory of artificial intelligence (AI) development, an integrated "AI system architecture" that encompasses design, logic, memory, and packaging is essential.

Song Jaehyuk, President and Chief Technology Officer (CTO) of Samsung Electronics Device Solutions (DS) Division, is delivering a keynote speech at Semicon Korea 2026 held at COEX in Gangnam-gu, Seoul, on the 11th. Photo by Jang Bokyoung

In his keynote speech at "Semicon Korea 2026" held at COEX in Gangnam-gu, Seoul, on this day, President Song said, "As we move beyond agent AI toward physical AI, the increase in workloads will be enormous," adding, "We are preparing technologies that will reduce memory bandwidth constraints."

Taking the stage as the first keynote speaker of the day, President Song said, "We are currently going through the era of algorithm-centric perception AI and generative AI, but in the future, a transition to agent-type AI and physical AI will be inevitable."

He then highlighted Samsung Electronics' "co-optimization" plan currently in preparation, emphasizing that "an integrated AI system architecture that simultaneously optimizes design, logic, memory, and packaging is needed." He explained that the company plans to respond to the AI era through integrated optimization that spans design, process, memory, and packaging.

He also introduced next-generation products such as c (custom) HBM and zHBM. President Song said, "We are preparing custom HBM that can secure greater bandwidth by taking the lead in adopting die-to-die interface IP," adding, "We have obtained experimental results showing that we can reduce the number of I/Os and cut power consumption by more than half."

He continued, "Going one step further, we are also considering Samsung custom HBM and are communicating with customers," and added, "We are preparing to have the base die handle a certain portion currently handled by the graphics processing unit (GPU), so that we can satisfy customers in terms of speed and power consumption."

Regarding "zHBM," he introduced it as "a technology that will once again achieve a major breakthrough in terms of the amount of bandwidth and power efficiency required in the era of physical AI."

Samsung Electronics is also preparing optical-signal packaging technology to increase inter-chip connection speeds in AI data centers. President Song said, "Samsung's goal is to maximize customer value by bringing together devices, processes, packages, and design," adding, "We will support the explosive demand of the AI era."

Semicon Korea, the largest semiconductor exhibition in Korea, will be held for three days from this day through the 13th. Backed by the semiconductor supercycle, it is expected to attract a record number of participating companies and visitors.

A large number of chipmakers and materials, parts, and equipment companies will participate, including not only Korean companies such as Samsung Electronics and SK Hynix, which are driving the supercycle, but also U.S. firms Intel and Micron, Japan's Kioxia, and the Netherlands' ASML.