Hanmi Semiconductor Achieves Record-High Sales in 2025

Hanmi Semiconductor announced on the 9th that it posted annual sales of 576.7 billion won last year, marking the highest revenue since its founding in 1980. The operating margin came in at 43.6%, maintaining a top-tier level of profitability in the industry.

The company explained that renewing its record-high sales for the second consecutive year, following 2024, is seen as a result of its technological competitiveness being recognized in the semiconductor market. In particular, its HBM (High Bandwidth Memory) TC Bonder, a core piece of equipment for AI semiconductors, captured a 71.2% market share to rank No. 1 globally and drive sales growth.

This year as well, the global AI semiconductor market is expected to see a sharp increase in capital expenditures by global memory companies compared with the previous year, driven by surging demand for high-end HBM. Recently, market research firm TechInsights projected that the TC bonder market will grow at an average annual rate of about 13.0% from 2025 to 2030. In fact, global HBM manufacturers are set to begin full-scale mass production of HBM4 this year, and are preparing for mass production of HBM4E around the end of this year and the beginning of next year, which is expected to significantly expand demand for new TC bonders suited to these products. Samsung Electronics, SK hynix, Micron, and Chinese companies are at the center of this trend.

Micron, in particular, announced in its earnings release in December 2025 that it would raise its total capital expenditure for 2026 from the previous 18 billion dollars (about 26.4 trillion won) to 20 billion dollars (about 29.3 trillion won) and significantly expand its HBM production capacity.

In practice, Micron acquired AUO's display fab in Taiwan in August 2024 and, starting in 2025, began construction of an advanced DRAM and NAND wafer manufacturing plant in the Woodlands area of Singapore. In addition, the company has announced successive plans to expand its facilities in Hiroshima, Japan, and to build a megafactory in the United States equivalent in size to 800 soccer fields. By building Singapore into a production hub for AI semiconductors (HBM, HBF), Micron is pursuing an aggressive strategy over the next five years to secure leadership in the global AI semiconductor market.

This aggressive expansion of HBM production facilities by Micron is expected to have a significant positive impact on sales growth for Hanmi Semiconductor's TC bonders, which were recognized last year as Micron's best partner and received the "Top Supplier" award.

Hanmi Semiconductor launched the "TC Bonder 4" for HBM4 production in 2025 and plans to release a "Wide TC Bonder" for HBM5 and HBM6 production in the second half of this year. Wide HBM is drawing attention as a new type of TC bonder that can fill the gap left by hybrid bonders (HB) for HBM mass production, whose commercialization has been delayed due to technical challenges. At the same time, based on its original HBM hybrid bonder technology developed in 2020, Hanmi Semiconductor is communicating with customers to launch a next-generation advanced hybrid bonder in line with the expected timing of mass production of HBM with 16 or more stacks around 2029.

Hanmi Semiconductor is also preparing to launch new equipment this year in the AI system semiconductor field. These are various bonding systems adopted for high value-added AI package applications, including core equipment used in AI semiconductor packages that integrate HBM core dies, base dies, and GPUs/CPUs, as well as in CPO (Co-Packaged Optics) packaging. The lineup includes big-die TC bonders, big-die FC bonders, and die bonders, which the company plans to supply to foundries and OSAT companies in China and Taiwan.

Hanmi Semiconductor is actively expanding sales of its core equipment in the global aerospace sector as well. Its EMI shield equipment is essential for space exploration rockets, low Earth orbit (LEO) satellite communications, and defense drones. Since first introducing EMI shield equipment in 2016, Hanmi Semiconductor has continued to hold the No. 1 market share in this segment, and over the past four consecutive years it has exclusively supplied EMI shield equipment lines to a global aerospace company, thereby proving its technological competitiveness.

A Hanmi Semiconductor representative said, "With the continued growth of the AI semiconductor market and the expansion of aggressive investments by global semiconductor companies, we expect HBM demand to be higher than ever. On the back of this trend, we forecast that Hanmi Semiconductor will again set new record-high results in 2026 and 2027," adding, "We will further strengthen our leadership in the global semiconductor equipment market by developing next-generation products and expanding our production capacity."