Hanmi Semiconductor Recruits Former Apple Executive Vice President Lee Myungho

Hanmi Semiconductor announced on January 14 that it has recruited semiconductor expert Lee Myungho, formerly of Apple in the United States, as Executive Vice President.

Executive Vice President Lee Myungho will oversee development and sales at Hanmi Semiconductor, focusing on strengthening new product and technology development. The company expects that he will further solidify Hanmi Semiconductor's business through the expansion of global clients and strategic collaborations.

Executive Vice President Lee is a veteran with over 25 years of experience in the semiconductor industry, having played key roles at global semiconductor companies such as Apple, Texas Instruments (TI), JCET·StatsChipPAC, and Amkor Technology. Based on his hands-on experience in product development, process technology, quality, and manufacturing, he has led the development and mass production of a wide range of advanced semiconductor packaging technologies, from lead frames to INFO.

At Apple, he worked for about 10 years from 2014, overseeing the development of semiconductor packaging for application processors (AP) used in major products such as the iPhone, Apple Watch, and iPad. He also led the development of battery management unit (BMU) circuits. During this period, he demonstrated his technological competitiveness by holding a U.S. patent related to EMI shielding (USPTO 9,793,222).

Prior to that, he worked at Texas Instruments (TI) for about 10 years from 2004 as an engineering manager, leading various global projects including those with Nokia. He spearheaded the development of next-generation packaging technologies and was appointed as a technical expert (MGTS) in the outsourced development organization for the first time.

At JCET·StatsChipPAC, he served as head of the product development team, leading program development with global clients such as Nvidia, Broadcom, and IBM. At Amkor Technology, he achieved outstanding results in packaging and materials technology development.

A Hanmi Semiconductor representative stated, "The addition of Executive Vice President Lee Myungho will be a significant turning point in elevating our global client response capabilities and next-generation semiconductor technology competitiveness. We expect this will further strengthen our position in the global market."

Hanmi Semiconductor, a global semiconductor equipment company, has more than 320 clients worldwide. It holds the number one position globally in the HBM TC bonder market, a core component for AI semiconductors, with a 71% market share, and is also the leader in the micro saw vision placement (MSVP) market.