LG Innotek Enters Glass Substrate Market, Accelerates 'Technology Development'

LG Innotek and UTI Sign R&D Partnership
Joint Development of Technology to Enhance Glass Substrate Strength

LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor packaging. The company plans to strengthen its competitiveness in the glass substrate sector by partnering with a specialist in precision glass processing.

On January 8, LG Innotek announced that it has entered into a research and development partnership with UTI, a company specializing in precision glass processing. Glass substrates are a next-generation substrate in which the core layer inside the substrate is replaced from plastic (organic) to glass. This minimizes warping caused by heat and allows for more precise circuit etching. It is considered a next-generation packaging technology optimized for advanced semiconductor substrates such as flip-chip ball grid array (FC-BGA).

Seoul Gangseo-gu LG Innotek Magok Headquarters panorama. LG Innotek

UTI is a company with advanced technology in the field of precision glass processing. Its strength lies in manufacturing thin yet highly durable reinforced glass for mobile devices, and it supplies smartphone cover glass made with this technology to major global smartphone manufacturers. Recently, the company has been working to expand its business into the glass substrate sector.

LG Innotek and UTI plan to jointly develop technology to enhance the strength of glass substrates. During the manufacturing process, fine holes must be drilled into the glass substrate, which can reduce its strength. If the strength is compromised, it can lead to critical quality issues, making glass reinforcement technology extremely important.

Last year, LG Innotek announced its entry into the glass substrate market. Since then, the company has established a pilot production line for glass substrates at its domestic facilities and has been accelerating technology development by collaborating with global clients and domestic and international companies possessing glass substrate technology. Going forward, LG Innotek plans to apply glass substrate technology to its flagship high-value-added semiconductor substrate, FC-BGA, to further strengthen its competitiveness in the packaging business.

President Moon Hyuksu emphasized, "Glass substrates are a technology that will transform semiconductor packaging," adding, "By combining 50 years of substrate material technology with precision glass processing, we will introduce outstanding innovative products."

Meanwhile, LG Innotek has identified high-value-added substrate businesses for artificial intelligence (AI), semiconductors, and communications as new growth drivers for the future, and has announced its goal to expand these businesses to reach annual sales of 3 trillion won by 2030.