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[CES 2026] SK Hynix Unveils HBM4 16-Layer 48GB for the First Time...Kwak Nojeong Meets with Nvidia (Comprehensive)

Operating a Customer Exhibition Hall... Showcasing HBM and More
Successor to HBM4 12-Layer 36GB... Achieves Industry-Leading Speed
HBM3E 12-Layer 36GB Also on Display
SOCAM 2, LPDDR6, and 321-Layer QLC Featured as Well
Kwak Nojeong: "I am here

SK Hynix unveiled its sixth-generation high bandwidth memory (HBM4) 16-layer 48GB product for the first time at CES 2026, the world's largest electronics and IT exhibition, held in Las Vegas, USA from January 6 to 9 (local time).



[CES 2026] SK Hynix Unveils HBM4 16-Layer 48GB for the First Time...Kwak Nojeong Meets with Nvidia (Comprehensive) CES 2026 SK Hynix Exhibition Rendering. SK Hynix

This product is the successor to the previously released HBM4 12-layer 36GB model and achieves an industry-leading speed of 11.7Gbps. SK Hynix explained, "Development is proceeding smoothly in line with our customers' schedules."


SK Hynix also showcased its fifth-generation HBM (HBM3E) 12-layer 36GB product, which will be the mainstay of the HBM market this year. The company also presented a GPU module for the latest artificial intelligence (AI) servers from global customers, equipped with this product.


In addition to HBM, SK Hynix introduced the SOCAM2, a low-power memory module specialized for AI servers; LPDDR6, a low-power DRAM optimized for on-device AI implementation; and the 321-layer 2Tb (terabit) QLC product, optimized for ultra-high-capacity enterprise solid-state drives (eSSD), which are seeing a surge in demand due to the expansion of AI data center construction.


SK Hynix is also operating an "AI System Demo Zone," where visitors can observe how memory solution products for AI systems form an ecosystem and connect organically. In this zone, the company is exhibiting and demonstrating a range of products, including "custom HBM (cHBM)" tailored to specific AI chip or system requirements; "AiMX," an accelerator card for generative AI based on PIM semiconductors that offers low cost and high efficiency; "CuD," which performs computation directly in memory; "CMM-Ax," which integrates computational functions into CXL memory; and "CSD," a data-centric solution that autonomously recognizes, analyzes, and processes data.


[CES 2026] SK Hynix Unveils HBM4 16-Layer 48GB for the First Time...Kwak Nojeong Meets with Nvidia (Comprehensive) SK Hynix CES 2026 Exhibition Products. (Clockwise from the left) ▲HBM4 16Hi 48GB ▲SOCAMM2 ▲LPDDR6. SK Hynix

This year, SK Hynix is participating in CES under the theme "Building a Sustainable Future with Innovative AI Technology" and has decided to focus exclusively on its customer exhibition hall.


Kim Joosun, President of AI Infrastructure and Chief Marketing Officer (CMO) at SK Hynix, stated, "As the innovation driven by AI accelerates, customers' technical requirements are evolving rapidly. We will meet these needs with differentiated memory solutions while creating new value for the advancement of the AI ecosystem."


Meanwhile, CEO Kwak Nojeong, President Kim, and other SK Hynix executives met with representatives from Nvidia immediately after a special keynote speech by Nvidia CEO Jensen Huang at the Fontainebleau Hotel that afternoon. When asked by reporters about the purpose of his visit, CEO Kwak replied, "I came for a meeting."


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