[Click eStock] "Hanmi Semiconductor to Continue TC Bonder Growth"

CTT Research analyzed on November 5 that demand for TC bonders-equipment necessary for producing high-bandwidth memory (HBM)-will increase through 2027, and Hanmi Semiconductor is expected to benefit.

Hanmi Semiconductor began full-scale mass production of TC bonders for HBM in 2022. The company froze equipment supply prices. For HBM3E equipment, it modified and improved existing equipment supplied to customers. As a result, the average selling price (ASP) was sometimes lower compared to supplying entirely new equipment.

CTT Research predicted that starting from HBM4, Hanmi Semiconductor will supply equipment at prices 30-40% higher. The company is expected to stop modifying existing equipment and supply only new equipment, which should lead to an increase in ASP. Since the prices supplied to North American customers are 30-40% higher than those for domestic customers, profitability is expected to improve.

From HBM4 onward, the interface will double to 2048 bits compared to HBM3E, and 2048 through-silicon vias (TSVs) will also be required. As die size increases, the number of necessary TC bonders is also expected to rise.

CTT Research also forecast that North American customers’ Taiwan fabs and Singapore Woodlands fabs will begin bringing in equipment starting next year, so Hanmi Semiconductor’s TC bonder orders are expected to continue throughout the year. The company is expected to supply at least 50% of the TC bonders needed by Asian fabs.

This is expected to result in further growth.