[Market Feature] Iron Device Surges on Selection as New Participant in "K-Humanoid Alliance"

Iron Device is showing strong performance. This is believed to be influenced by the news that the company will participate in the government-led "K-Humanoid Alliance."

As of 10:40 a.m. on September 17, Iron Device was trading at 4,305 won, up 17.95% from the previous day.

According to industry sources on this day, Iron Device announced that it has been selected as a new participating company in the "K-Humanoid Alliance," which is overseen by the Ministry of Trade, Industry and Energy and operated by the Korea Evaluation Institute of Industrial Technology (KEIT). Iron Device plans to develop semiconductor power control systems for humanoid robot actuators and secure key intellectual property (IP) assets.

The K-Humanoid Alliance is a government-led project launched with the goal of making South Korea the world’s leading country in humanoid technology by 2030. It was established in April under the supervision of the Ministry of Trade, Industry and Energy, with participation from the government, major domestic robot companies, leading universities, and research institutes. As the alliance has been recruiting new companies for core sectors, Iron Device was additionally selected as a robot component supplier.

Iron Device possesses core technologies for designing high-performance isolated and non-isolated gate drivers and current sense amplifiers specialized for compound semiconductor power devices such as GaN (gallium nitride) and SiC (silicon carbide). The company stated that it is expected to contribute to reducing the overall system size and cost of humanoid robots by utilizing foundational technology for miniaturizing packages and the world’s first diagonal placement technology, which enables mounting even on single-layer substrates.

With its participation in the K-Humanoid Alliance, Iron Device also plans to expand the application of its previously developed high-performance gate drivers for GaN power devices. In particular, the company intends to collaborate with specialized packaging companies to develop circuits for 100V-class GaN power device gate driver ICs suitable for humanoid robot drive systems and to advance ultra-miniaturized packaging technology at the 5.0 mm x 5.0 mm level, integrating power devices.